SAN FRANCISCO -- At a press event here today, Intel Corp. officially rolled out its awaited 0.13-micron Pentium III processor-M series with speeds up to 1.13-GHz at a price of $625 each in quantities of 1,000.
In addition, Intel introduced three new 830 chip sets designed to take advantage of the new mobile Pentium III processor-M performance and low power characteristics.
The Intel 830MP chip set supports external graphics and is available today, said the company. Later this year, Intel said it plans to ship the 830M chip set with high-performance integrated graphics. The 830MG chip set will also be available later this year with integrated graphics for lower cost systems, Intel said.
The new 830 chip set series use high-performance PC-133 synchronous DRAMs, which is 33% faster than memory supported in the previous Intel 440BX chip set, said product managers. The new chip sets also include 1-gigabyte memory support for a 50% increase over previous generations, said the Santa Clara, Calif., processor giant.
The new mobile Pentium III processor-M series is available in five speed grades: 1.13 GHz, 1.06 GHz, 1.0 GHz, 933 MHz, and 866 MHz. Intel's "Enhanced Speed Step" automatic mode enables the processor to run up to 1.13 GHz at 1.4 volts in maximum performance mode. In "battery optimized mode," it runs at 733 MHz and 1.15 volts, and consumes less than 2 watts of average power, according to Intel.
In 1,000- unit quantities, the Intel 830MP chip set is priced at $37.50 each.
The Pentium III processor-M CPUs are housed in either micro-flip-chip ball-grid array or micro-flip-chip pin-grid array packages. The price of the 1.06-GHz processor is $499 in 1,000-piece quantities. In similar quantities, pricing for speed grades are: $394 for 1.0 GHz, $278 for 933 MHz, and $247 for 866 MHz.
RSS
Digital
FPGA startup crunch:
These articles are part of a series that examines the status of various FPGA startups in light of the economic recession. Startups Abound Logic, Achronix Semiconductor and Cswitch are all on the hot seat.
10 fab technologies on the hot seat:
There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling.
6 fab technologies on the bubble:
It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble.
Our take on Intel-River:
With its acquisition of embedded software leader Wind River Systems Inc., Intel Corp. has unambiguously signaled that it is again attempting to diversify beyond X86 processors. Here's our take on the deal.
CEVA's reversal:
When Gideon Wertheizer, CEVA's CEO, came to New York to ring the closing bell at Nasdaq to celebrate the company's 10th year anniversary, he talked about CEVA's 21.6 percent revenue growth in 2008.
Hot technologies to watch for in 2009:
Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away.
Top 20 predictions for semis in 2009:
To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors?
Silicon 60 version 8.0
The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions.
RSS| 
Digital| 
Mobile
