United Business Media EE Times


Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

HP transfers server-oriented chip set group to Intel








Silicon Strategies


SANTA CLARA, Calif. -- In an apparent move to cut costs, Hewlett-Packard Co. plans to transfer the engineers from its server-oriented chip set group to Intel Corp.

Under the terms of the deal, Intel will hire under 100 engineers from HP's Cupertino Systems Lab. Based in Cupertino, Calif., the engineers in the lab develops chip sets for HP's computers based on its proprietary PA-RISC processor.

The deal with Intel does not involve HP's chip set technology. It's unclear if HP has scrapped its server-oriented chip set business.

The HP engineers will be transferred to Intel's Enterprise Platform Group, which develops Intel's server-oriented microprocessor lines, according to a spokesman for Santa Clara, Calif.-based chip maker. The HP engineers will work on server-oriented chip products, including the 64-bit Itanium processor and future product lines, the spokesman said.

"This is a way to add more expertise for Intel," the spokesman said.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
Federal CTO Sees IT Leading U.S. Out Of Recession
Aneesh Chopra is looking to other CIOs to advise him on fleshing out a more detailed agenda to best serve the president's IT agenda.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

FPGA startup crunch: These articles are part of a series that examines the status of various FPGA startups in light of the economic recession. Startups Abound Logic, Achronix Semiconductor and Cswitch are all on the hot seat. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Our take on Intel-River: With its acquisition of embedded software leader Wind River Systems Inc., Intel Corp. has unambiguously signaled that it is again attempting to diversify beyond X86 processors. Here's our take on the deal. More...

CEVA's reversal: When Gideon Wertheizer, CEVA's CEO, came to New York to ring the closing bell at Nasdaq to celebrate the company's 10th year anniversary, he talked about CEVA's 21.6 percent revenue growth in 2008. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 8.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About