United Business Media EE Times


Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Intel again delays Ireland wafer fab








EBN


SANTA CLARA, Calif. -- Intel Corp. late Wednesday confirmed industry reports that the $2 billion 300-mm wafer Fab 24 in Leixlip, Ireland, has been delayed another year, until the second half of 2003.

An Intel spokesman said the downturn in the semiconductor market meant the extra production was not needed as quickly as planned.

A 300-mm wafer can yield almost twice as many comparable size die as on a 200-mm wafer. Intel continues on schedule with ramping up its first 300-mm wafer pre-production at its development fab in Oregon and the first production fab in Albuquerque, N.M., slated to open late this year or early 2002.

The Leixlip fab is slated to become Intel's second 300-mm production facility. Originally Fab 24 was planned as a 200-mm wafer plant, but last year was changed to the larger wafer size production, while at the same time its opening was pushed back a year, to late 2002. That opening has again slipped about 12 months, the spokesman said.

He emphasized that despite the Ireland fab delay, Intel is sticking to its capital spending forecast for 2001 of $7.5 billion. Analysts have repeatedly said that Intel was likely to cut that figure, but the company has insisted it wants to be in position to take advantage of an industry upturn.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
Federal CTO Sees IT Leading U.S. Out Of Recession
Aneesh Chopra is looking to other CIOs to advise him on fleshing out a more detailed agenda to best serve the president's IT agenda.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

FPGA startup crunch: These articles are part of a series that examines the status of various FPGA startups in light of the economic recession. Startups Abound Logic, Achronix Semiconductor and Cswitch are all on the hot seat. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Our take on Intel-River: With its acquisition of embedded software leader Wind River Systems Inc., Intel Corp. has unambiguously signaled that it is again attempting to diversify beyond X86 processors. Here's our take on the deal. More...

CEVA's reversal: When Gideon Wertheizer, CEVA's CEO, came to New York to ring the closing bell at Nasdaq to celebrate the company's 10th year anniversary, he talked about CEVA's 21.6 percent revenue growth in 2008. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 8.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About