United Business Media EE Times


Search

HOMELATEST NEWSSEMICONDUCTORSMOST POPULARMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSS

 

Intel to stress market convergence at forum








EBN


Intel Corp. will use its fall Intel Developer Forum in San Jose next week to emphasize market convergence, further blurring the line between its traditional PC focus and continued push into communications.

Highlights will include the first details of Intel's Banias mobile microprocessor, which is expected to feature wireless Ethernet and 802.11a connectivity, and the introduction of two processors aimed at broadening the company's position in communications networking.

"The convergence of the computing and communications industries is not a new concept, but we'll speak to how silicon technology relates to that convergence, [leading] to anywhere, any- time computing, and assists people who desire to use any device to talk to any other device anywhere, anytime," said Frank Spindler, vice president of Intel's Corporate Technology Group.

Intel next Tuesday will take the wraps off its new Xeon and XScale processors. The Xeon is targeted at applications and service processing, and the XScale at control-plane processing, both within network equipment platform blades. The chip introductions demonstrate Intel's continued effort to gain socket space in the networking equipment market by using traditional processing technologies.

Within networking platforms, blades are becoming attractive alternatives to new servers. Driving the trend are equipment manufacturers and service providers seeking to add new revenue sources and expand processing capabilities with existing platforms, said Tom Franz, vice president and general manager of Intel's Network Processor Group.

Working together

The new processors, the 1.6GHz LV Xeon and the 533MHz IXC1100 XScale-based control-plane processor, are designed to work in tandem with Intel's family of network processors, Franz said.

"I'm very pleased with the progress we're making with processors in communications," he said. "We've had this focus for quite a few years, and I think we're now seeing the fruits of those efforts."

Intel continues to lead the market in network processor design wins, said Linley Gwennap, an analyst at The Linley Group in Mountain

View, Calif. Despite slow network processor growth, design wins today should produce revenue in the years ahead, he said.

"Any company that's not investing in new system designs now is not going to be competitive when the market picks up," Gwennap said. "What Intel has been doing in the traditional network processor space has been very popular, and with some of these new parts they are bridging the space between those devices and the traditional server and PC processors they build."

The LV Xeon is available and is priced at $355 in quantities of 1,000. The device is optimized for low power, staying within the 30W processor thermal envelop for blades, Franz said. The IXC1100, with 2.4W power dissipation, will be in production within two months and is priced at $55 in 1,000s.

Intel will also disclose at the IDF its first cellular handset design win for X-Scale, from BSquare Corp., a Bellevue, Wash., OEM using the processor for a branded handset offering.

On the MPU side

Intel is also expected to provide the most details yet on Banias, a mobile device designed from the ground up. Slated to debut officially late this year, Banias is expected to provide significantly lower power consumption than the company's prior mobile PC offerings.

Banias reportedly will have a 1.6GHz frequency, but performance equal to a 2.2GHz Pentium 4.

"We'll discuss Banias in the context of form factors for mobility, high performance, and how you can do it in a small form factor with low power and elements that support moving toward seamless wireless connectivity," Spindler said.

Intel, Santa Clara, Calif., will also use the IDF to expand on its disclosure last month of its next-generation 90nm process, citing upcoming devices that will be produced with the advanced technology. The first 90nm desktop processor, the Prescott, will be detailed.

It isn't clear, though, whether Intel will discuss the Dothon, the first 90nm mobile processor, or the Nocona, the first 90nm Xeon server chip.

Spindler said details of Intel's first 3.06GHz processor will be disclosed. He declined, however, to comment on reports that the chip will be the first desktop processor to offer HyperThreading, a technique that allows a single processor to operate in the same fashion as dual processors.

New Itanium-2 server processors, the Madison with 6Mbytes of on-die cache, and the Deerfield with 3Mbytes of on-die cache, will be showcased. The devices are expected to be introduced in the first quarter of 2003.

Spindler declined to say whether Intel will detail the first core logic supporting the new DDR333 memory, or the new dual-memory channel chipsets, code-named Granite Bay, slated to debut in the fourth quarter to support desktop processors.

He also refused to say if discussion of the follow-on dual-channel Springdale chipset for Prescott, as well as a dual-channel version of Prestonia for Xeon services, called Placer, will be on the agenda.











  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Ready to take that job and shove it?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
Federal CTO Sees IT Leading U.S. Out Of Recession
Aneesh Chopra is looking to other CIOs to advise him on fleshing out a more detailed agenda to best serve the president's IT agenda.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

FPGA startup crunch: These articles are part of a series that examines the status of various FPGA startups in light of the economic recession. Startups Abound Logic, Achronix Semiconductor and Cswitch are all on the hot seat. More...

10 fab technologies on the hot seat: There's trouble brewing in chip-making paradise. Delivery of chips at 32-nm and beyond won't be a cool breeze. EE Times has constructed the following list of 10 fab technologies that could make or break future IC scaling. More...

6 fab technologies on the bubble: It isn't going to be a slam-dunk to deliver chips at 32-nm and beyond. See our story about 10 fab technologies on the hot seat. Then read this article: 6 technologies on the bubble. More...

Our take on Intel-River: With its acquisition of embedded software leader Wind River Systems Inc., Intel Corp. has unambiguously signaled that it is again attempting to diversify beyond X86 processors. Here's our take on the deal. More...

CEVA's reversal: When Gideon Wertheizer, CEVA's CEO, came to New York to ring the closing bell at Nasdaq to celebrate the company's 10th year anniversary, he talked about CEVA's 21.6 percent revenue growth in 2008. More...

Hot technologies to watch for in 2009: Every technologist, marketer, industry analyst and reporter on a hunt for the next big thing is bracing for the 2009 Consumer Electronics Show scheduled less than a month away. More...

Top 20 predictions for semis in 2009: To help sort out the confusion in the market, EE Times has released its own chip forecasts--and other predictions--for 2009. So, what will happen in analog, FPGAs, foundry, memory, MPUs and other sectors? More...

Silicon 60 version 8.0 The EE Times 60 Emerging Startups list, first published in April 2004, has been updated to version 8.0 to reflect the latest corporate, commercial, technology and market conditions. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About