SUNNYVALE, California -- Advanced Micro Devices Inc. and IBM Corp. have agreed to develop together process technologies for high-performance logic products and microprocessors, at 65-nanometer and 45-nm critical dimensions. The first chips built using the technology are expected in 2005.
The processes are intended to enhance the performance of the companies' processor architectures while reducing power consumption, the companies said.
The new processes will be based on the combined experience of the two major semiconductor makers in advanced structures and materials such silicon-on-insulator (SOI) transistors, copper interconnects and improved "low-k dielectric" insulation, the companies said. The agreement includes collaboration on 65-nm and 45-nm process technologies to be implemented on 300-mm diameter silicon wafers.
"We are set to commence production of our 90-nm solutions in the fourth quarter of 2003, so we are now expanding process-technology development efforts for our next generation of processors targeted at 65-nm and below," said Bill Siegle, senior vice president, technology operations and chief scientist at AMD, in a statement. "By collaborating with an industry leader like IBM, AMD can deliver industry-leading performance and functionality for our customers while reducing the rapidly escalating cost of technology development."
AMD and IBM said the terms of their agreement would allow them to use the jointly-developed process technologies to manufacture products in their own chip fabrication facilities and in conjunction with selected manufacturing partners. The companies expect first products based on the new 65nm technologies to appear in 2005.
In an industry with exponentially increasing development costs partnership would appear to be the immediate way forward for all but the largest of chipmakers. AMD has a manufacturing partnership with United Microelectronics Corp. of Taiwan and IBM recently announced a manufacturing partnership with Chartered Semiconductor of Singapore.
However, AMD and UMC have apparently ended their joint development deal as a result of AMD's new arrangement with IBM(see today's story ).
It is a major boost for IBM. "Today's marketplace demands the most advanced chip designs and materials technologies," said Bijan Davari, IBM Fellow and vice president, technology and emerging products, IBM Microelectronics division. "Our work with AMD is all about speeding our joint technologies into products, and helping reduce the time-to-market for customers."
The development will be supported by AMD and IBM engineers working together in IBM's Semiconductor Research and Development Center (SRDC) in IBM's East Fishkill, New York facility. Work is expected to begin by January 30, 2003, the companies said.
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