The new unit, dubbed the National Applications Engineering Group, will "help meet the productivity challenges of our U.S. customers," said Kiyoshi Morishima, vice president and general manager of the Semiconductor Equipment Division of Canon U.S.A., the U.S. arm of lithography-tool supplier Canon Inc. of Japan.

"The new group will work closely with our customers and industry partners to optimize processes and tool integration, evaluate and compare different process techniques and undergo product and process demonstrations for current and future lithography roadmap requirements," he said in a statement.

"As we move to more advanced lithography systems and integrated solutions, customers are demanding more comprehensive, full service, support teams that are capable of supporting a tool from fab-in to process, including hardware, software, process and lithography module expertise," added Tommy Oga, chief applications engineer of the Semiconductor Equipment Division of Canon U.S.A., in a statement.

"The new Applications Engineering Group will integrate and consolidate these key areas into one specialized group and will focus on improving our customers' return on their lithography investment," he said.