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NexFlash signs parent Winbond as flash foundry |
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(03/19/2003 5:17 AM EST) URL: http://www.eetimes.com/showArticle.jhtml?articleID=10801151 |
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SAN JOSE, Calif. -- NexFlash Technology Inc., a partially owned subsidiary of Winbond Electronics Corp. of Taiwan, has been developing non-volatile memory devices with partners Winbond Electronics Corp. and Sharp Corp. and is now gearing up to introduce a family of serial flash memories in the second half of 2003. NexFlash said today (March 19, 2003) that it has signed a foundry agreement with Winbond.
The agreement allows San Jose-based NexFlash to produce flash memory products using Winbond's 0.18 micron "WinStack" manufacturing process at Winbond's fab.
"Winbond's state-of-the-art manufacturing facilities enable NexFlash to mass-produce cost-effective and high-quality serial flash products," said Thomas Liao, president and chief executive officer of NexFlash, in a statement.
NexFlash said that because serial flash memories have less active pins than parallel flash memories they are becoming popular as a means to reduce system board space, power, noise and overall cost. However. NexFlash offered no details of the products the company intends to introduce or any indication that they would be superior to established products from competitors.
NexFlash was founded in October 1998 and Winbond acquired a minority stake in the company in February 2001 (see February 2, 2001, story).
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