SANTA CLARA, Calif. -- At next month's SPIE Microlithography conference here, major programs for next-generation lithography (NGL) will be in the limelight, including a bold and surprising disclosure by ASML Holding N.V. of the Netherlands.
ASML and other partners are expected to present a technical paper at SPIE, disclosing details on a new European consortium that is developing NGL tools and production systems based on extreme ultraviolet (EUV) technology. The SPIE event will take place in Santa Clara during March 3-8.
ASML's paper, entitled "Extatic, ASML's European a-tool development for EUVL," is co-authored by ASML, Carl Zeiss, Sagem, and Xenocs, according to the conference program.
The new European-led EUV effort--dubbed "Extatic" for the
EXTreme Ultraviolet Alpha Tool Integration Consortium--involves ASML, Zeiss, Sagem, and Xenocs, said a spokeswoman from ASML.
"Extatic" will address the "main system aspects and the basic optical system for use of extreme ultraviolet radiation for lithographic applications," said the ASML spokeswoman. The "goal of the consortium is to demonstrate that EUVL is the lithography technology of choice for the 50-nm node and beyond," she added.
ASML is also expected to become a "systems integrator" for a U.S.-led consortium that is developing a EUV tool. The Dutch company is expected to develop a commercial tool, built around the technology.
Last year, the U.S.-led consortium, called the Extreme Ultraviolet LLC (EUV LLC), announced that it had developed and demonstrated the world's first exposure tool based on EUV (see Feb. 27 story).
The EUV LLC is aiming its EUV-based tool for the development of next-generation devices with features sizes of 0.07 micron and below. The consortium is made up of Advanced Micro Devices, IBM, Infineon, Intel, Micron, Motorola, and U.S. Department of Energy's national laboratories.
Production-worthy EUV tools are not expected to be out in the market until 2007--or later, according to analysts. But some chip makers, namely Intel Corp., are looking to get their hands on an EUV production tool before 2005.
Meanwhile, at next month's SPIE event, the EUV LLC is expected to discuss new optics and other upgrades to the alpha tool. And in another presentation at SPIE, a representative from Hitachi Ltd. is expected to discuss Japan's efforts in EUV, in which Canon Inc. and Nikon Corp. are separately developing EUV tools.
Last year, Japan's Canon announced that it is developing a EUV tool at SPIE (see March 1, 2001, story ).
Nikon is also developing its own EUV tool, but the Japanese lithography giant is making a stronger push in a competitive technology called electron-beam projection lithography (EPL).
Nikon is working on an EPL exposure tool for use in making ICs with 0.07-micron and below features sizes. Nikon's alpha EPL system, called the EB stepper, is expected to ship in late 2004 or so. The Japanese lithography giant is building the tool platform, while partner IBM Corp. is developing the optics (see Feb. 22 story).
At next month's SPIE event, Nikon and IBM are expected to provide an update on the EPL technology, it was noted.
While several companies are racing to develop NGL tools, there are major advances in conventional optical lithography systems as well. Some believe that optical lithography is expected to last until the end of this decade, pushing out the need for NGL production tools to about 2010, based on process milestones set in the 2001 International Technology Roadmap for Semiconductors (ITRS) (see Nov. 29 story).
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