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Fairchild rolls out MicroPak as next-generation logic package
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Silicon Strategies


SOUTH PORTLAND, Maine--Fairchild Semiconductor International Inc. today released 50 standard logic functions in its new MicroPak chip-scale package, which is 65% smaller than widely used SC70 packages, according to the company. Fairchild said the MicroPak is its next-generation package for a wide range of logic and switch functions.

The South Portland-based chip maker said the MicroPak measures 1.45 mm x 1.0 mm, but the chip-scale package (CSP) features relatively large 0.2-mm-x-0.3-mm contact pads for strong joint integrity on surface-mounted printed-circuit boards. The package has pitch spacing between contacts of 0.5 mm.

MicroPak logic products and switches are used in cell phones, personal digital assistants (PDAs) and a wide range of other products. Ken Murphy, manager of logic products at Fairchild, claims his company provides the largest portfolio of single-, dual- and configurable-gates, decoders, multiplexers, and analog switches for wireless and portable products.

The new MicroPak packages are lead-free and rated MSL-1, which eliminated special dry-bag handling systems, Fairchild said.

The next-generation MicroPak provides six-terminal packages, to support single-input logic and more complex dual- and triple-input logic functions, said the company. In 1,000-piece quantities, the MicroPak packaged two-input AND gate NC7SZ08L6 is $0.156, and for the three-state buffer NC7SZ125L6X is $0.196 each.






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