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Taiwan's Via rolls out world's first mobile processor based on 0.13-micron technology
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Silicon Strategies


TAIPEI, Taiwan -- At the Computex trade show here today, Taiwan's Via Technologies Inc. rolled out a mobile version of its so-called VIA C3 microprocessor line, based on a 0.13-micron process technology.

Debuting at speeds of 800-MHz, the new mobile VIA C3 processor from Via features the world's smallest die size and lowest power consumption.

The processor is designed for "a complete range of full-featured, slim and light, and mini-note notebooks covering all market segments," said Wenchi Chen, president and CEO of Taipei-based Via.

Certain versions come with Via's so-called LongHaul power management technology, which can reduce the processor's voltage and clock speed to maximize battery life. Other features include 128-KB of Level 1 cache and 64-KB of Level 2 cache. It supports the 100/133-MHz Front Side Bus, MMX and 3DNow! multimedia instructions.

The processor is based on a 0.13-micron technology from Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). The mobile VIA C3 processor is available in a choice of PGA, micro PGA, and EBGA package types.






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