VELDHOVEN, the Netherlands -- ASM Lithography here today announced what the company claims is the world's most advanced argon-fluoride (ArF), 193-nm exposure tool for 300-mm wafer processing.
The new AT:1100 scanner from the Dutch-based lithography giant is geared for high-volume production of both 200- and 300-mm wafers at the 100-nm (0.10-micron) node. Built around the company's 300-mm, dual-stage platform--the Twinscan--the AT:1100 features the industry's highest numerical aperture (0.75), according to ASML.
The system also incorporates the advanced StarLith 1100 lithography-lens, which is developed and manufactured by its long-time optics partner--Carl Zeiss of Germany. The 193-nm optics in the system enables chip makers to utilize binary photomasks, thereby avoiding more expensive phase-shift masks and other technologies in chip processing, according to ASML.
The AT:1100 is targeted for chip makers in the cutting-edge DRAM, logic, silicon foundry and related markets, said Roger Irwin, product manager for ASML. "This is our first 193-nm tool geared for 300-mm wafer processing," Irwin said. "With this product, ASML has clearly taken the lead in the 193-nm tool market," he said in an interview.
In the past, ASML offered a 193-nm tool based on its 200-mm platform. Other suppliers of 193-nm scanners include two Japanese vendors--Canon Inc. and Nikon Corp.
In addition, Silicon Valley Group (SVG)--which was recently acquired by ASML for about $1.6 billion--is also developing a separate 193-nm scanner line as well.
A key to ASML's new 193-nm tool is the company's Twinscan 300-mm platform. The Twinscan dual-wafer stage technology enables wafer processing to take place in parallel.
In chip processing, this technology enables the exposure of one wafer, while simultaneously aligning the next wafer for production. This, in turn, eliminates overhead time and allows continuous patterning of wafers for maximum productivity. In total, the AT:1100 achieves a throughput of 93 wafers an hour.
The AT:1100 also features a new 4-KHz ArF laser. The laser, coupled with dual-scan architecture, is said to process wafers at the 100-nm node and less than 20-nm overlay accuracy across the wafer at full throughput.
ASML has already received orders for the AT:1100, with shipments due by year's end. Although the company did not elaborate on its customer base, the systems will be reportedly shipped to several key chip makers, reportedly including Infineon, Philips, Micron, and Taiwan Semiconductor Manufacturing Co. Ltd., according to analysts.