United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 

ASML rolls out advanced 193-nm scanner for 300-mm production
Print this article Email this article Reprints RSS Digital Edition

Silicon Strategies


VELDHOVEN, the Netherlands -- ASM Lithography here today announced what the company claims is the world's most advanced argon-fluoride (ArF), 193-nm exposure tool for 300-mm wafer processing.

The new AT:1100 scanner from the Dutch-based lithography giant is geared for high-volume production of both 200- and 300-mm wafers at the 100-nm (0.10-micron) node. Built around the company's 300-mm, dual-stage platform--the Twinscan--the AT:1100 features the industry's highest numerical aperture (0.75), according to ASML.

The system also incorporates the advanced StarLith 1100 lithography-lens, which is developed and manufactured by its long-time optics partner--Carl Zeiss of Germany. The 193-nm optics in the system enables chip makers to utilize binary photomasks, thereby avoiding more expensive phase-shift masks and other technologies in chip processing, according to ASML.

The AT:1100 is targeted for chip makers in the cutting-edge DRAM, logic, silicon foundry and related markets, said Roger Irwin, product manager for ASML. "This is our first 193-nm tool geared for 300-mm wafer processing," Irwin said. "With this product, ASML has clearly taken the lead in the 193-nm tool market," he said in an interview.

In the past, ASML offered a 193-nm tool based on its 200-mm platform. Other suppliers of 193-nm scanners include two Japanese vendors--Canon Inc. and Nikon Corp.

In addition, Silicon Valley Group (SVG)--which was recently acquired by ASML for about $1.6 billion--is also developing a separate 193-nm scanner line as well.

A key to ASML's new 193-nm tool is the company's Twinscan 300-mm platform. The Twinscan dual-wafer stage technology enables wafer processing to take place in parallel.

In chip processing, this technology enables the exposure of one wafer, while simultaneously aligning the next wafer for production. This, in turn, eliminates overhead time and allows continuous patterning of wafers for maximum productivity. In total, the AT:1100 achieves a throughput of 93 wafers an hour.

The AT:1100 also features a new 4-KHz ArF laser. The laser, coupled with dual-scan architecture, is said to process wafers at the 100-nm node and less than 20-nm overlay accuracy across the wafer at full throughput.

ASML has already received orders for the AT:1100, with shipments due by year's end. Although the company did not elaborate on its customer base, the systems will be reportedly shipped to several key chip makers, reportedly including Infineon, Philips, Micron, and Taiwan Semiconductor Manufacturing Co. Ltd., according to analysts.






  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Looking for a new job?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
Anita Borg Institute Honors 3 Women
Group Honors Three Women For Contributions To Tech

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

10 emerging technologies to watch: EE Times has compiled a list of emerging technologies that we think will be worth watching out for in 2010. Biofeedback or thought-control of electronics are among the contenders. More...

Hot applications in 2010: We've compiled a list of 10 technology applications you should watch for in 2010, ranging from e-book readers to 3-D TVs. We examine the features that make these apps so compelling as well unresolved issues. More...

Top 25 predictions for semis in 2010: 2010 is just beginning to unfold in the electronics industry. Looking into our crystal ball, we have released our own chip forecasts--and other predictions--for 2010. More...

Seven things to fix in 2010: The editors of EE Times came up with their own informal list of things we hope engineers fix in 2010, spanning everything from nano-lithography to space travel. What do you want to see get done this year? More...

'09 moves that are shaping the future: This was a brutal year, but the industry gets a nod for showing grace under fire. Here's our Top 10 guide to the coming year, illustrating what to expect in 2010. More...

10 CEOs out in 2009: It's been a tough year for the global electronics industry and CEOs. We survey the dismissal of 10 industry CEOs during the first three quarters of 2009 and what's ahead for the rest of the year. More...

Notable women in microelectronics: There is no better time than a global economic recession to examine the keys to successful corporate governance. So, EE Times has compiled an international list that celebrates women who are business and technology leaders in semis. More...

EE Times updates Silicon 60: Seventeen companies have been added to the lastest version of our Silicon 60 list of emerging startups. Forty-three companies survived as emerging companies that are still worth watching. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2010 EE Times Group, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About