SANTA CLARA, Calif. -- Continuing its rapid expansion into 300-mm wafer-processing technologies, Intel Corp. here is reportedly planning to set up another 300-mm fab, this time in Silicon Valley, according to a new report from Prudential Securities Inc. The new development fab could represent Intel's seventh 300-mm wafer plant to date.
Intel will not comment on the report, but an e-mail newsletter from Prudential Securities said the chip giant plans to convert its 200-mm R&D fab, located near its headquarters in Santa Clara, into a 300-mm development center. The "D2" facility has primarily served as a 0.18-micron R&D fab, using 200-mm (8-inch) wafers. It is now expected to be converted to 300-mm substrates for 0.13-micron technology development by 2002, said the report issued on Thursday.
"Our proprietary field checks reveal that Intel has decided to convert its 200-mm D2 Santa Clara fab to a 300-mm fab in 2002," said the New York-based brokerage firm. "Currently, D2 is ramping Pentium 4 processors at 0.13-micron technology and also builds flash memories," the report added.
When asked if the fab would be converted to 300-mm wafers, an Intel spokesman responded, "We have not made any announcements about D2."
The spokesman acknowledged that Intel has completed the fourth module in the D2 plant, which will build chips based on 0.18-micron design rules.
The conversion of the D2 plant could represent the seventh 300-mm (12-inch) wafer facility that is either operating, under construction, or on the drawing boards at Intel. The world's largest semiconductor manufacturer plans to operate three 300-mm fabs in Hillsboro--separate D1C and D1D development fabs and the new "RP1" research facility.
Two months ago, SBN reported that Intel was planning to build the new D1D 300-mm fab (see May 14 story). Intel is also planning dedicated 300-mm production fabs in New Mexico, Ireland, and Arizona.
A significant portion of Intel's record $7.5 billion capital spending budget in 2001 has been earmarked for 300-mm processing lines and new copper-chip technologies.
--Mark LaPedus
RSS
Digital
10 emerging technologies to watch:
EE Times has compiled a list of emerging technologies that we think will be worth watching out for in 2010. Biofeedback or thought-control of electronics are among the contenders.
10 CEOs out in 2009:
It's been a tough year for the global electronics industry and CEOs. We survey the dismissal of 10 industry CEOs during the first three quarters of 2009 and what's ahead for the rest of the year.
Executive pay:
The economy stinks. Rank-and-file engineers are feeling the pain. What about technology CEOs? We crunched the numbers buried in corporate financial statements to find out. Here's what we found.
10 companies in trouble (revisited):
What follows is an updated version of 10 companies in trouble. Some companies have been removed since the last version, others remain. Still others have been added to the mix.
Early predictions for 2010:
The electronics industry is recovering, but there is still some uncertainty in the market. Some see a boom year in 2010. Some see a double dip. So what's in store for the rest of this year and 2010?
Top 10 IC vendors with cash:
The world's biggest IC companies by revenue rank not only among the best in their respective industry segments but are also more likely to have huge piles of cash that can be used to fund acquisitions, R&D and product development.
Notable women in microelectronics:
There is no better time than a global economic recession to examine the keys to successful corporate governance. So, EE Times has compiled an international list that celebrates women who are business and technology leaders in semis.
EE Times updates Silicon 60:
Seventeen companies have been added to the lastest version of our Silicon 60 list of emerging startups. Forty-three companies survived as emerging companies that are still worth watching.
RSS| 
Digital| 
Mobile
