FOUNTAIN VALLEY, Calif. -- Kingston Technology Co. Inc. here today announced plans to ramp production of double data rate (DDR) memory modules in the fourth quarter after beginning initial samples of products to system manufacturers. The memory modules supplier said it is expanding its manufacturing capacity by 30% with the addition of advanced surface-mount technology lines for DDR and other high-performance products.
"Kingston is investing in new CSP chip-scale packaging-capable manufacturing equipment to ensure that all manufacturing centers will be ready to build more synchronous, Rambus, and DDR modules today while also being enabled for volume production of next-generation memory modules," said David Sun, co-founder of Kingston Technology. "Kingston currently ships over two million modules per month, and we want to ensure that additional manufacturing capacity is available worldwide to support strong unit shipment growth for both the Kingston branded and our OEM memory divisions."
The company said it has begun shipping samples of DDR dual in-line memory modules (DIMMs) to original equipment manufacturers for use in system development. These modules are expected to be used in new servers, workstations, desktop computers and mobile systems--all of which are set for introduction in the fourth quarter this year and 2001. Both 200-MHz and 266-MHz DDR DIMMs will be shipped in volume.
According to Kingston, four new surface-mount technology lines have been added at the company's Americas Manufacturing Center in Fountain Valley. Another four chip-scale packaging lines are in Kingston's center in Hsinchu, Taiwan, and additional expansion is planned later this year at the company's facility in Dublin, Ireland.
"Kingston is also focusing on production test flows, capacity, and cost, which are critical for the ramp of any new memory technology," Sun said. The company said it has partnered with DRAM suppliers to complete programming of its Advantest Corp. testers for high volume of DDR modules.
The company is also working on its Rambus DRAM module offering as well. "Kingston's collaboration with Intel Corp. in the development of a low-cost RIMM Rambus in-line memory module tester has met all our initial goals," said Steven Chen, vice-president of the company's Technology & Test Engineering Division. "As a result, we are confident that we can apply the lessons we've learned in developing a similar tester for DDR DIMM modules."
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