HSINCHU, Taiwan -- In a clear sign that pure-play silicon foundries have closed the technology gap with the large chip houses, Taiwan Semiconductor Manufacturing Co. Ltd. today announced it has begun taping out the first 0.13-micron IC designs from customers for production.
During September, TSMC expects to tape out at least seven customer designs for its 0.13-micron copper-chip processes--which, according to the Hsinchu-based foundry giant, is more than a year ahead of the industry's technology roadmap.
The announcement comes six months after TSMC said it had begun to distribute copper-based 0.13-micron test chips to electronic design automation suppliers, which used the devices to accelerate EDA tools for the advanced foundry process technology (see March 28 story). Today, TSMC officials declared the taping out of 0.13-micron chip designs was additional evidence that the company had taken a solid lead in process technology among its foundry rivals and integrated device manufacturers (IDMs), which operate their own wafer fabs to produce IC products.
TSMC's archrival--United Microelectronics Corp. (UMC)--also claims to have a lead in 0.13-micron foundry services. Several months ago, UMC announced it was the first to produce working prototypes using a 0.13-micron copper process (see May 12 story). UMC, which is also based in Hsinchu, said it expects to begin pilot production of 0.13-micron products before the end of this year.
In its announcement today, TSMC--the world's largest pure-play silicon foundry--said the first taped-out IC designs for 0.13-micron production are expected to be fabricated in the fourth quarter this year. The company's roadmap for 0.13-micron production shows the initial wave of designs to begin in the fourth quarter with full qualification of core 0.13-micron drawn feature size processes being completed in March 2001.
Earlier this week, TSMC president F.C. Tseng hinted of today's announcement, saying that the foundry company had accelerated its 0.13-micron process schedule by about three months from its previous plan. He also told SBN that the company remains on schedule to start processing its initial 300-mm wafers by the end of this year (see Sept. 11 story).
TSMC is running its initial 0.13-micron process on 200-mm (8-inch) wafers, offering four varieties of the technology. A core CL013G technology is aimed at easing the migration of designs to the next-generation process, with emphasis on computing, communications, and high-density logic, said TSMC.
A low-voltage, high-performance version of the 0.13-micron process, designated CL013LV, is also available and aimed at early adopters in performance-oriented applications, such as microprocessors, graphics, networking, and high-speed SRAMs, said TSMC. A low-power verion, called CL013LP, is also being rolled out for portable and wireless applications. And, TSMC said it is working on an "ultra-high-speed" derivative of the 0.13-micron technology, called CL013HS, which will be aimed at specialized applications.
TSMC said it will tape out customer designs in the CL013G core, CL013LP low-power, and low-voltage (CL013LV) processes in September. The 0.13-micron processes will be supported by design libraries from Artisan Components, Avanti, Nurlogic Design, Synopsys, and Virage Logic, said the Hsinchu foundry supplier. Additional EDA tool suppliers are also working on offerings for the process, TSMC added.
RSS
Digital
10 emerging technologies to watch:
EE Times has compiled a list of emerging technologies that we think will be worth watching out for in 2010. Biofeedback or thought-control of electronics are among the contenders.
Hot applications in 2010:
We've compiled a list of 10 technology applications you should watch for in 2010, ranging from e-book readers to 3-D TVs. We examine the features that make these apps so compelling as well unresolved issues.
Top 25 predictions for semis in 2010:
2010 is just beginning to unfold in the electronics industry. Looking into our crystal ball, we have released our own chip forecasts--and other predictions--for 2010.
Seven things to fix in 2010:
The editors of EE Times came up with their own informal list of things we hope engineers fix in 2010, spanning everything from nano-lithography to space travel. What do you want to see get done this year?
'09 moves that are shaping the future:
This was a brutal year, but the industry gets a nod for showing grace under fire. Here's our Top 10 guide to the coming year, illustrating what to expect in 2010.
10 CEOs out in 2009:
It's been a tough year for the global electronics industry and CEOs. We survey the dismissal of 10 industry CEOs during the first three quarters of 2009 and what's ahead for the rest of the year.
Notable women in microelectronics:
There is no better time than a global economic recession to examine the keys to successful corporate governance. So, EE Times has compiled an international list that celebrates women who are business and technology leaders in semis.
EE Times updates Silicon 60:
Seventeen companies have been added to the lastest version of our Silicon 60 list of emerging startups. Forty-three companies survived as emerging companies that are still worth watching.
RSS| 
Digital| 
Mobile
