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AMD runs silicon in 300-mm wafer fab, preps 65-nm process
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Peter Clarke
EE Times
(04/07/2005 1:05 PM EDT)

LONDON — Processor vendor Advanced Micro Devices Inc. has started running wafers through Fab36, the company's 300-mm wafer fab located in Dresden, Germany and is on course to have commercial production in 2006, according to Tom Sonderman, the company's director of APM technologies.

"We are qualifying equipment as we speak. Fab36 was designed to be a 65-nm from the start. We are making great strides with IBM and our SRAM yields are hitting all our milestones," Sonderman told EE Times in a telephone interview. "The whole idea is to begin to process 65-nm in the middle of 2005 and bring it into production in 2006. We're certainly on schedule." Sonderman said wafers first ran in Fab36 in March 2005 and that first "wafer outs" would occur in the second-half of 2005. He added that only 300-mm wafers would be run at Fab36 in Dresden although the neighboring wafer fab — Fab30 — runs a 90-nm SOI manufacturing process on 200-mm diameter wafers.

"The 90-nm transition was very successfully put into Fab30 at close to mature yields. By mid-2005 100 percent of AMD64 manufacturing will be on 90-nanometer SOI wafers," said Sonderman. He added that by then the ramp-up would have taken just six to nine months from first commercial silicon in the fourth quarter of 2004.

"One of the big advantages of our Automated Precision Manufacturing system is that we can take 90-nm on 200-mm data from Fab30, 65-nm on 300-mm data from East Fishkill and see the commonalities and apply them to Fab36.

Sonderman added that AMD engineers are helping Singapore foundry Chartered Semiconductor Manufacturing install the APM system in CHartered's 300-mm wafer fab along with an AMD 90-nm SOI process. Sonderman said that running 90-nm circuits on 300-mm wafers with Chartered would also help build up useful experience.






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