United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 

IBM cranks dual-core Power6 beyond 4GHz
Print this article Email this article Reprints RSS Digital Edition

EE Times


SAN JOSE, Calif. — IBM Corp. will go back to the future with its next-generation Power6 design by pushing raw speed rather than trying to pack more cores on a die.

The CPU will run at speeds between 4-5GHz with a total of 8Mbytes L2 cache and a 75Gbyte/second link to external memory.

The Power6 doubles the frequency and bandwidth of the existing Power5 without increasing its power consumption or the depth of its execution pipeline. The move lets IBM ship the chip as a mid-2007 refresh for its existing p-series server line.

"We needed to scale the whole system. When you just pack on more cores and don't scale the cache and memory bandwidth you can't really scale CPU performance as well," said Brad McCredie, a fellow in IBM's Systems and Technology Group.

The Power6 will essentially follow the pattern set by IBM with the Power4 and 5 CPUs. The Power4 was among the first computer CPUs to put two cores on a single die. The company packed two dice on a single module for high-end versions of the chip. Intel Corp. likewise plans to use multi-chip modules to pack two dual-core dice on a family of quad-core chip modules it will start introducing in November.

IBM may surpass Intel in the speed race, although it has not determined exact speeds for shipping parts yet. Intel currently ships versions of its single-core Pentium running at up to 3.8GHz, but it slows its dual-core CPUs down to 2.93GHz or less to keep power and heat in check.

Thus the big news for IBM is how it can double frequency while holding the line on power consumption and pipeline depth. New circuit designs and process technology improvements plow the way for the advances. The chip uses "new and highly complex latch and static gate circuits," said McCredie.

The processor is built in a 65-nm process using IBM's silicon-on-insulator (SOI) and strained silicon technology. IBM applied new techniques in variable gate lengths and variable threshold voltages to squeeze maximum performance per Watt at the transistor level. The chip can be fully operated at as little as 0.8V.

"That enables us to take this chip into many low-end environments" said McCredie.

In addition, IBM will link its Power CPU for the first time to an external embedded controller. The controller will monitor and adjust power and performance parameters on the CPU based on set power management policies.

IBM is now in a systems test and debug phase using the Power6 in high-end, midrange and cluster computers for its p-series servers.






  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Looking for a new job?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
DoD Recognizes University Scientists For Basic Research
Annual awards to university faculty to conduct next-generation research projects were announced this week by the Defense Department.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.



All White Papers »   

  Around Silicon Strategies

10 emerging technologies to watch: EE Times has compiled a list of emerging technologies that we think will be worth watching out for in 2010. Biofeedback or thought-control of electronics are among the contenders. More...

Hot applications in 2010: We've compiled a list of 10 technology applications you should watch for in 2010, ranging from e-book readers to 3-D TVs. We examine the features that make these apps so compelling as well unresolved issues. More...

Top 25 predictions for semis in 2010: 2010 is just beginning to unfold in the electronics industry. Looking into our crystal ball, we have released our own chip forecasts--and other predictions--for 2010. More...

Seven things to fix in 2010: The editors of EE Times came up with their own informal list of things we hope engineers fix in 2010, spanning everything from nano-lithography to space travel. What do you want to see get done this year? More...

'09 moves that are shaping the future: This was a brutal year, but the industry gets a nod for showing grace under fire. Here's our Top 10 guide to the coming year, illustrating what to expect in 2010. More...

10 CEOs out in 2009: It's been a tough year for the global electronics industry and CEOs. We survey the dismissal of 10 industry CEOs during the first three quarters of 2009 and what's ahead for the rest of the year. More...

Notable women in microelectronics: There is no better time than a global economic recession to examine the keys to successful corporate governance. So, EE Times has compiled an international list that celebrates women who are business and technology leaders in semis. More...

EE Times updates Silicon 60: Seventeen companies have been added to the lastest version of our Silicon 60 list of emerging startups. Forty-three companies survived as emerging companies that are still worth watching. More...

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2010 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About