United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 

IBM gives update on STT-based MRAM
Print this article Email this article Reprints RSS Digital Edition

EE Times


SAN FRANCISCO -- At this week's International Electron Devices Meeting (IEDM) here, IBM Corp. will provide a sneak preview of its MRAM, based on spin torque transfer (STT) technology.

In a paper, IBM will describe the key element of a 4-Kbit test device. The element, dubbed a magnetic tunnel junction (MTJ), is a 70- x 210-nm2 device said to have 10-year data retention cycle, a breakdown-to-voltage margin over 0.5-V and a read-induced disturbance rate of 10-9.

An 8-Ohm um2 MTJ is said to show ''sufficient'' read/write margin, thermal stability and write endurance. The device is said to be free of unwanted write-induced magnetic reversal.

The technology could enable a 64-megabit device based on 90-nm design rules, according to IBM's paper. IBM builds MTJs with MgO tunnel barriers. With those design rules, a single-bit line can be as tiny as 9F2.

''For the targeted MTJ operating point at (about) 4 x 106 A/cm2, the cell size is 30F2,'' according to IBM.

Last year, IBM launched a joint research and development project with TDK Corp. to create high-density magnetic random access memories (MRAMs). The new multiyear program will aim for a 20-fold increase in the memory density of MRAMs by switching to a writing mechanism, called spin-momentum transfer, that draws less power and uses smaller bit cells.

STT-based MRAM is gaining steam in the market. Korea's Hynix Semiconductor Inc. and Japan's Renesas Technology Corp. have separately announced deals for Grandis Inc.'s technology. Japan's Toshiba Corp. and Korea's Samsung Electronics Co. Ltd. are reportedly taking a close look at Grandis' technology.

IBM, Everspin and others are reportedly devising at their own STT technologies. Most MRAMs write data by applying the magnetic field generated by a current running through a wire near a tunneling magnetoresistive (TMR) element to change the magnetization. That enables fast operation but gobbles up power.

Grandis' spin-torque transfer method uses a spin-polarized current to switch magnetic bits, a technique that is said to consume less power and enhances scalability. An STT-RAM writes data by aligning the spin direction of the electrons flowing through a TMR element.

All told, STT-RAM claims to combine the capacity and cost benefits of DRAM, the fast read and write performance of SRAM, and the non-volatility of flash.



Related Links:

  • Update: IBM teams with TDK on MRAM
  • Grandis gains Darpa award for STT-RAM
  • Renesas seeks to commercialize MRAM



  •   Free Subscription to EE Times
    First Name Last Name
    Company Name Title
    Email address
      Click here for your Free Subscription to EETimes Europe
     
    CAREER CENTER
    Looking for a new job?
    SEARCH JOBS
    SPONSOR

    RECENT JOB POSTINGS
    CAREER NEWS
    DoD Recognizes University Scientists For Basic Research
    Annual awards to university faculty to conduct next-generation research projects were announced this week by the Defense Department.

    For more great jobs, career related news, features and services, please visit EETimes' Career Center.



    All White Papers »   

      Around Silicon Strategies

    10 emerging technologies to watch: EE Times has compiled a list of emerging technologies that we think will be worth watching out for in 2010. Biofeedback or thought-control of electronics are among the contenders. More...

    Hot applications in 2010: We've compiled a list of 10 technology applications you should watch for in 2010, ranging from e-book readers to 3-D TVs. We examine the features that make these apps so compelling as well unresolved issues. More...

    Top 25 predictions for semis in 2010: 2010 is just beginning to unfold in the electronics industry. Looking into our crystal ball, we have released our own chip forecasts--and other predictions--for 2010. More...

    Seven things to fix in 2010: The editors of EE Times came up with their own informal list of things we hope engineers fix in 2010, spanning everything from nano-lithography to space travel. What do you want to see get done this year? More...

    '09 moves that are shaping the future: This was a brutal year, but the industry gets a nod for showing grace under fire. Here's our Top 10 guide to the coming year, illustrating what to expect in 2010. More...

    10 CEOs out in 2009: It's been a tough year for the global electronics industry and CEOs. We survey the dismissal of 10 industry CEOs during the first three quarters of 2009 and what's ahead for the rest of the year. More...

    Notable women in microelectronics: There is no better time than a global economic recession to examine the keys to successful corporate governance. So, EE Times has compiled an international list that celebrates women who are business and technology leaders in semis. More...

    EE Times updates Silicon 60: Seventeen companies have been added to the lastest version of our Silicon 60 list of emerging startups. Forty-three companies survived as emerging companies that are still worth watching. More...

     
    Education and
    Learning


    Learn Now:












    Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
    Network Websites
    International
    Network Features




    All materials on this site Copyright © 2010 TechInsights, a Division of United Business Media LLC All rights reserved.
    Privacy Statement | Terms of Service | About