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Amkor, NMD, Toshiba form IC-assembly venture
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EE Times


SAN JOSE, Calif. -- After some delays, Nakaya Microdevices Corp. (NMD), Amkor Technology Inc. and Toshiba Corp. have signed definitive agreements for the formation of a joint venture to provide semiconductor assembly and final testing services in Japan.

NMD, Amkor and Toshiba entered into discussions regarding a possible joint venture at the start of this year. The new company is expected to begin operations on Oct. 31.

Under the terms, NMD will become a joint venture. It will change its name to J-Devices Corp.

Some 60 percent of the venture is owned by the existing shareholders of NMD, 30 percent by Amkor and 10 percent by Toshiba.

Under the definitive agreements, the following equipment and operations will be transferred to J-Devices: the back-end process business, including technology development, at Toshiba LSI Package Solutions Corp. (TPACS), a Japan-based semiconductor packaging company wholly owned by Toshiba; the system LSI and memory back-end process equipment at TPACS' Oita Works and Fukuoka Works; and certain wafer probing equipment installed at Toshiba's Oita Operations. TPACS' employees working for the transferred business will engage in the same business at J-Devices.

Amkor is expected to invest approximately 1.5 billion yen ($17 million) in J-Devices and to purchase certain assembly and test equipment from Toshiba for about 4.0 billion yen ($44 million) and lease such equipment to J-Devices.

Toshiba is expected to invest approximately 0.5 billion JPY. In addition, Amkor will have the right to acquire a majority interest in J-Devices in 2012.



Related Links:

  • Toshiba, Amkor delay IC-packaging venture



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