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Intel again delays Ireland wafer fab








EBN


SANTA CLARA, Calif. -- Intel Corp. late Wednesday confirmed industry reports that the $2 billion 300-mm wafer Fab 24 in Leixlip, Ireland, has been delayed another year, until the second half of 2003.

An Intel spokesman said the downturn in the semiconductor market meant the extra production was not needed as quickly as planned.

A 300-mm wafer can yield almost twice as many comparable size die as on a 200-mm wafer. Intel continues on schedule with ramping up its first 300-mm wafer pre-production at its development fab in Oregon and the first production fab in Albuquerque, N.M., slated to open late this year or early 2002.

The Leixlip fab is slated to become Intel's second 300-mm production facility. Originally Fab 24 was planned as a 200-mm wafer plant, but last year was changed to the larger wafer size production, while at the same time its opening was pushed back a year, to late 2002. That opening has again slipped about 12 months, the spokesman said.

He emphasized that despite the Ireland fab delay, Intel is sticking to its capital spending forecast for 2001 of $7.5 billion. Analysts have repeatedly said that Intel was likely to cut that figure, but the company has insisted it wants to be in position to take advantage of an industry upturn.











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