Latest News
Headlines for Sunday, February 12, 2012
Technology
e-Learning platform for ZigBee sensor networks accelerates time to market
Global wireless platforms market worth $155.2 billion by 2016
Living room video calling users to surpass 16 million in 2015, says In-Stat
Wi-Fi chipset revenue to reach $6.1 Billion in 2015
Continental joins OPEN Alliance Ethernet consortium
In-flight broadband deployments to surpass 6,100 planes in 2015, says In-Stat
NFC aid for the visually and hearing impaired
Headlines for Friday, February 10, 2012
Business
Apple claims Motorola misusing Qualcomm license
Analyst: Micron still in negotiations with Elpida
New 9-inch Amazon Kindle Fire due out in summer
Imagination technologies to see big royalty uptick
TI lengthened analog IC lead in 2011
Chip stocks have room to grow, says analyst
European research project to boost solar cell efficiency
Taiwan processor firm uses compiler tester from ACE
TSMC sales jump in January, still down on 2011
NXP swings to loss in Q4, optimistic on Q1
Product
Micron launches lower power DDR3 DRAM
Technology
IMEC announces directed self-assembly process line
Headlines for Thursday, February 9, 2012
Technology
Microsoft: Windows 8 on ARM to be 'no-compromise' experience
Updated: UMC 28-nm roll out beating expectations
Common Platform group to discuss 14-nm at forum
CNSE and partners share research results at SPIE
Business
Intel pays $6.5 million to settle N.Y. antitrust suit
Application list for Windows 8 beta released
Analyst: Apple took 80% of handset profits in Q4
ON Semi shakes off impact of Thai site closures
Report: CMOS in, CCD out of image focus
Rebuilding America: U.S. plans manufacturing webcast
Analyst's model predicts 3% chip market growth in 2012
SMIC posts loss, but sees uptick ahead
Product
Xilinx is omnipresent in the 2012 UBM Electronics ACE Awards
Headlines for Wednesday, February 8, 2012
Technology
Next-gen video codec hits milestone
Business
UMC to boost 2012 capex to $2 billion
Rebuilding America: Silicon Valley is back
APEC: Linear Tech's perspective
SEMI Europe symposium to review IC industry goals
Nokia: No "Plan B" should Windows Phone fail
Nokia shifts assembly to Asia, plans to lay off 4,000
Product
Conexant has 32-bit processor for hi-performance audio
ST adds 32-bit MCU to 9-axis inertial sensor
Cavium, Freescale roll embedded processors
Headlines for Tuesday, February 7, 2012
Technology
SIA makes public technology roadmap
Cree claims LED price-performance breakthrough
User interface firm offers OpenCL benchmarking tool
Researchers develop novel form of hafnium oxide
Business
India wafer fab decision expected by end of 2012
VC Kleiner Perkins launches engineering student fellowship
Intel’s Romley poised to roil data center
FujiPanaRene: clinging to the wreckage
Nikkei: Japanese firms look to merge system IC units
LTE femtocells ready to take off as API ecosystem expands
Mindspeed completes acquisition of Picochip
Mindspeed completes Picochip acquisition
Plessey buys Cambridge spin-off for HB LEDs
Design
Kilopass NVM IP qualified at 130-nm at TowerJazz
Product
Transphorm announces GaN products at 600-V
Headlines for Monday, February 6, 2012
Extra!
Questions Cloud Outlook at 'New' AMD 
Business
Veeco sees no near-term uptick in LED market
BlackBerry PlayBook sees further price cuts
Rambus buys memory startup for $35 million
Global chip sales squeeze 0.4% annual growth
Intel terahertz supplier secures $5.5 million funds
Technology
Product
Broadcom RFIC shrinks microwave backhaul nets
Career
Reports: trace carcinogens found in Korean wafer fabs
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