Latest News

Headlines for Tuesday, February 19, 2013

Technology

London Calling: Intel Israel lobbies to get 10-nm node

ISSCC: ASML says EUV best option at 10nm

Business

DESIGN West: How to fund your tech startup with Kickstarter

Marvell rolls quad-core IC for 3G

Headlines for Monday, February 18, 2013

Technology

Carver Mead: Finish the physics revolution

Business

Microsoft machine learning takes on 'big data'

Former Freescale CEO takes Dialog director's seat

TransferJet to demo speedy wireless at MWC

Slideshow: Google updates fiber offer

Headlines for Saturday, February 16, 2013

Business

Tensilica vs. Ceva in imaging/vision IP core battle

MEMS market growth accelerating

Headlines for Friday, February 15, 2013

Conferences & Shows

SEMI adds startup forum to Semicon West

Design

Case studies highlight temperature solutions for 3-D ICs

Intel research improves moisture-tracking in PCBs

Technology

Slideshow: Berkeley wields big data to beat cancer

Business

Indian chip industry body broadens remit

SK Telecom sets up Silicon Valley incubator

Headlines for Thursday, February 14, 2013

Business

Applied Materials' sales top estimates

London Calling: Mobile phone sales fell in 2012

Tower sees soft Q1, then growth

Yoshida in Japan: Renesas' cuts are GloFo's gain

Taiwanese server makers outflanking traditional OEMs

Intel outlines Internet TV service plan

Technology

Ericsson to demo Gbit LTE at Mobile Congress

Headlines for Wednesday, February 13, 2013

Business

Ten chip sectors tipped to grow

London Calling: The best-connected chip executive

Yoshida in NY: Why we need an imaging IP core