Latest News
Headlines for Thursday, February 23, 2012
Business
SEMI book-to-bill improves for fourth straight month
Micron increasing stake in Inotera
Qualcomm chooses MasterImage 3D for development tablet
Microsoft begins aggressive new Windows Phone campaign
Cree to hold 'iconathon' to hone energy-efficiency logo
Genusion licenses B4-Flash to Rohm, Lapis
ADI, Avago see slight uptick in business
Extra!
Three Reasons To Take Silicon Labs Seriously 
Mobile Congress: Wireless Nets Move Front and Center
Product
New tablets to feature MIPS for both applications and baseband processing
Conferences & Shows
MWC: Cognovo, R&S to demo LTE carrier aggregation
Technology
APIC announces Ge laser, photonic IC to follow
RFID chip lets readers talk first for use in retail apps
ISSCC: Pictures from a silicon exhibition
Memory firms detail sub-20-nm NAND chips
Headlines for Wednesday, February 22, 2012
Design
Mentor expands support for UVM
Business
GPU shipments had another down Q4
Magma's Madhavan won't join Synopsys
Panasonic's waterproof Android Eluga smartphone unveiled
Analyst: Mobile MEMS market rising to $6bn in 2016
ConEd Solutions partners with Viridity on road to 'smart grid'
Dialog on a mobile roll sees strong Q1
Smart roles high endurance MLC drive
EET on the QT
Altera, Xilinx Spar in High-Frequency Trading
ARM Mulls Nonvolatile Memory IP Deal
Marvell in the TV Chip Biz for the Long Haul
MediaTek: You Need It, We’ve Got It
Space Plane Regs Cleared for Takeoff
ARM, Intel Target Military Electronics
VC Watch
Startup MicroGen Systems Aims to Shake Up Energy Harvesting
Market Data
Securing Mobile Devices in Health Care
Lay of the Land
Feds’ Support for Cleantech R&D in the Crosshairs
Technology
ISSCC: Voltage regulators stacked in 3-D
MEMS actuators fight robot tug-of-war
Glasses-less 3-D, free-viewpoint coming to future TVs
Moving implant, body nets advance at ISSCC
ISSCC: SanDisk set to show highest density NAND flash
EU project boosts OPV for solar power generation
Company Teardown
Headlines for Tuesday, February 21, 2012
Technology
MOST150 from MOST Cooperation hits the road
Wireless will redefine the home audio market as we know it
Sound enhancing technology boosts mobile sounds by doubling air volume in loudspeaker
Altera demos first FPGAs to interoperate with 100-Gbps optical module
Tabula’s next-gen FPGAs to use Intel’s 22nm process featuring 3-D tri-gate transistors
How best to reduce power on future ICs
ISSCC: Path to optical links still dark
AMD, not ARM, first to use startup's low-power clock IP
Thermal Diffusivity Sensors: Temperature Sensors that Scale
Terahertz CMOS debuts at ISSCC
Business
Samsung positions its fab to take on TSMC
Why I don’t buy Eyal’s 40G story
January chip sales fell 15% year-on-year, says analyst
Market for transparent conductors in PV apps to reach $300M in 2016
Arrow to deliver Micropelt’s thermoharvesting power module
CEVA launches new low-power DSP cores for the broadest comms standards
Intel confirmed as foundry for second FPGA startup
Product
Samsung gives peek at quad-core mobile CPU
Tensilica offers BBE32UE core for low-power LTE
Extra!
Conferences & Shows
Xilinx plan to strut their stuff at Embedded World 2012
Headlines for Monday, February 20, 2012
Technology
Intel gives deeper look into Ivy Bridge
Updated: Job ad discloses SanDisk resistive RAM program
Business
Huawei places $6-billion chip order with U.S.
ST's Carlo Ferro appointed COO at ST-Ericsson
Headlines for Sunday, February 19, 2012
Technology
ISSCC: Intel focuses on low power, digital RF
Headlines for Saturday, February 18, 2012
Technology
Samsung chip lowers cost of LTE, says analyst
Headlines for Friday, February 17, 2012
Technology
Test problems grow as chip integration increases
Engineers propose nanogrids, smarter switches
Business
Nokia pins app hopes on Boston office
Femto Forum is renamed Small Cell Forum
TSMC set to receive Matrix 13,000 e-beam litho machine
Extra!
Ethernet: Coping with the Coming Data Tsunami
Product
ZiiLabs samples 100-core, HEVC-ready Android SoC
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