Latest News
Headlines for Monday, February 27, 2012
Business
ISS Europe 2012 ponders 450mm wafer fab challenges
Facebook joins W3C to combat browser fragmentation
Rambus CEO Harold Hughes to retire
Postcards from Barcelona: MWC Day 1
MWC: Intel targets high-, low-end smartphones
Qualcomm, HiSilicon, China drive unified LTE
Orange launches Intel powered smartphone
Elpida files for bankruptcy protection after bailout fails
Mindspeed/Astri TD-LTE demo a first at MWC
HiSilicon and IMEC to cooperate on RF R&D at 28nm
Conferences & Shows
Slideshow: Inside the Android booth at MWC
Xilinx to highlight 7 Series FPGAs and 100G technology at OFC 2012
Technology
Blue Pearl is offering free hands-on workshops…
Product
Nokia announces camera phone with 41 megapixel sensor
Sensor may bring touchscreen to feature phones
LSI, TI, Freescale in 28nm base station battle
Headlines for Sunday, February 26, 2012
Technology
Smart appliance shipments to exceed 24 Million units by 2017, but high prices remain a barrier
Green Hills, Jungo bring connectivity to automotive infotainment
Multi-standard transceiver for sensor networks sets record for low power
Telecom operators successfully complete next generation Wi-Fi hotspot trials
Harman demos automotive LTE connectivity platform
Bluetooth low energy enabled iPhone applications for mobile health
Product
Huawei claims quad-core chip outguns Tegra3
Business
Intel's Ivy Bridge delayed, says senior executive
HTC unveils One series with dual and quad core phones
Headlines for Saturday, February 25, 2012
Business
Ericsson plays standards cards to LTE win
Headlines for Friday, February 24, 2012
Business
STMicro toasts 2 billionth MEMS shipped to date
Technology
ISSCC highlights sensors and semiconductor technology in medicine
Headlines for Thursday, February 23, 2012
Business
SEMI book-to-bill improves for fourth straight month
Micron increasing stake in Inotera
Qualcomm chooses MasterImage 3D for development tablet
Microsoft begins aggressive new Windows Phone campaign
Cree to hold 'iconathon' to hone energy-efficiency logo
Genusion licenses B4-Flash to Rohm, Lapis
ADI, Avago see slight uptick in business
Extra!
Three Reasons To Take Silicon Labs Seriously 
Mobile Congress: Wireless Nets Move Front and Center
Product
New tablets to feature MIPS for both applications and baseband processing
Conferences & Shows
MWC: Cognovo, R&S to demo LTE carrier aggregation
Technology
APIC announces Ge laser, photonic IC to follow
RFID chip lets readers talk first for use in retail apps
ISSCC: Pictures from a silicon exhibition
Memory firms detail sub-20-nm NAND chips
Headlines for Wednesday, February 22, 2012
Design
Mentor expands support for UVM
Business
GPU shipments had another down Q4
Magma's Madhavan won't join Synopsys
Panasonic's waterproof Android Eluga smartphone unveiled
Analyst: Mobile MEMS market rising to $6bn in 2016
ConEd Solutions partners with Viridity on road to 'smart grid'
Dialog on a mobile roll sees strong Q1
Smart roles high endurance MLC drive
EET on the QT
Altera, Xilinx Spar in High-Frequency Trading
ARM Mulls Nonvolatile Memory IP Deal
Marvell in the TV Chip Biz for the Long Haul
MediaTek: You Need It, We’ve Got It
Space Plane Regs Cleared for Takeoff
ARM, Intel Target Military Electronics
VC Watch
Startup MicroGen Systems Aims to Shake Up Energy Harvesting
Market Data
Securing Mobile Devices in Health Care
Lay of the Land
Feds’ Support for Cleantech R&D in the Crosshairs
Technology
ISSCC: Voltage regulators stacked in 3-D
MEMS actuators fight robot tug-of-war
Glasses-less 3-D, free-viewpoint coming to future TVs
Moving implant, body nets advance at ISSCC
ISSCC: SanDisk set to show highest density NAND flash
EU project boosts OPV for solar power generation
Company Teardown
Headlines for Tuesday, February 21, 2012
Technology
MOST150 from MOST Cooperation hits the road
Wireless will redefine the home audio market as we know it
Sound enhancing technology boosts mobile sounds by doubling air volume in loudspeaker
Altera demos first FPGAs to interoperate with 100-Gbps optical module
Tabula’s next-gen FPGAs to use Intel’s 22nm process featuring 3-D tri-gate transistors
How best to reduce power on future ICs
ISSCC: Path to optical links still dark
AMD, not ARM, first to use startup's low-power clock IP
Thermal Diffusivity Sensors: Temperature Sensors that Scale
Terahertz CMOS debuts at ISSCC
Business
Samsung positions its fab to take on TSMC
Why I don’t buy Eyal’s 40G story
January chip sales fell 15% year-on-year, says analyst
Market for transparent conductors in PV apps to reach $300M in 2016
Arrow to deliver Micropelt’s thermoharvesting power module
CEVA launches new low-power DSP cores for the broadest comms standards
Intel confirmed as foundry for second FPGA startup
Product
Samsung gives peek at quad-core mobile CPU
Tensilica offers BBE32UE core for low-power LTE
Extra!
Conferences & Shows
Xilinx plan to strut their stuff at Embedded World 2012
|
Most Popular
Datasheets.com Parts Search
185 million searchable parts
(please enter a part number or hit search to begin)
