Latest News
Headlines for Sunday, June 10, 2012
Business
Q1 chip inventories signal rising demand, IHS says
Technology
M2M software platform market to reach $3.85 billion by 2017, says ABI
Tablets to drive telemedicine market growth to more than 300% by 2018
Patient status engine combines wireless body-worn sensors with cloud-based electronic health record
Phablets hybrid communication devices to surpass 208 million unit shipments annually in 2015
Research centre looks to autonomic machine-based service networks
Total GPS/GNSS IC market to reach 1.8 billion shipments by 2016, says ABI Research
Lightfair: NXP addresses Internet-enabled lighting
Headlines for Friday, June 8, 2012
Business
Marvell unleashes 802.11ac combo chip
Apple’s iOS 6 confirmed by a banner
ITC launches probe of RF chips used by Moto, HTC
Room for IC industry expansion, analyst says
AMD's Su joins the board of Analog Devices
Report: SK Group mulls chip fab in Turkey
Extra!
ARM servers: Heavy lifting, big payoffs ahead
Product
NXP offers driver ICs for non-dimmable LED lamps
Financial
Foundries sales trends diverge in May
Technology
Genetic engineering for synthetic semiconductors
High-tech rats to root out land mines
Headlines for Thursday, June 7, 2012
Business
IQE buys RFMD's epi-wafer plant, no cash down
Gilles Delfassy joins board of Imagination
Samsung to spend $1.9 billion on logic fab, says report
Product
Nanoampere MCU is designed to serve sensors
Extra!
How Leo Li led Spreadtrum's turnaround
Technology
Slideshow: Medtech entrepreneurs build Indian health care from ground up
Design
DAC panel spotlights rise of IP subsystems
Headlines for Wednesday, June 6, 2012
Technology
EuroFab450 is an ambitious dream
Haptic display/keyboard uses microfluidics to surface
Intel FinFETs vary, may need SOI for shrink, says GSS
European report considers 450-mm More-than-Moore fab
Business
CSR buys Trident's audio processor line
Get smart: Energy effort seeks to link consumers, technology
Mobile data flood spurs network innovations
Getting wired: Q&A with Ericsson’s CTO
Product
E Ink targets new display niches
Intel makes flow processor with ARM inside
Applied launches Trident ion implantation system
Chinese startup offers tri-axis accelerometer
Headlines for Tuesday, June 5, 2012
Business
Indian gov't hires Accenture to review fab proposals
Four reasons why its 'game over' for foreign chip firms in China
SIA, WSTS expect flat chip sales in 2012
Nanosys teams with 3M film to yield less-costly LCDs
Gregg Lowe, ex-TI exec, takes helm at Freescale
MicroGen chooses X-Fab to make energy harvest MEMS
GloFo, TSMC report process tech progress
Design
Zytronic provides multitouch display for industrial apps
Display measurement standard debuts
In U.S. push, Japanese EDA vendor hits first DAC
Technology
UMC, Singapore's IME team on TSV process for image sensors
Microsemi denies FPGAs have backdoor security flaw
Product
PMC rolls radio chips sets for basestations
SanDisk sampling 19-nm embedded NAND
Headlines for Monday, June 4, 2012
Business
Freescale shows sensor 'black-box' for Win8
Indian expat engineers bring medtech back home
UBM Electronics launches redesigned EDN.com
U.S. tariffs on Chinese solar panels could slow industry
Statum develops multitouch/stylus platform with Nissha
Half-billion-dollar Nanosolar raises $70 million
Design
Synopsys exec sees whole new ball game at 20 nm
Tiempo, ST announce 32-nm asynchronous design flow
Gary Smith hails multi-platform design methodology
Technology
Blackbox Biometrics testing ADI MEMS for Blast Gauge monitor
Video: Five ways to get an edge in Indycar
Researchers develop easy way to measure power
Product
ST packages MEMS microphones in plastic
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