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Headlines for Tuesday, June 19, 2012

Business

Panel: ARM to dominate consumer apps

TI opens window on its diverse technologies

Spansion announces voice recognition chip

Atom gets first ride in HP's CPU-agnostic server

Spreadtrum TD-SCDMA IC goes in Samsung GALAXY S III

Freescale adopts ARM cores in QorIQ line

Is China's fabless model sustainable?

Report: Renesas Mobile up for sale in re-org

Et tu, Ballmer, or M’soft’s stab at tablets

Technology

TI brings HD to 3-D printing

Freescale tips core-agnostic system architecture

Next app for TI's DLP is large touchscreens

Product

Microsoft picks both ARM and Intel for tablet

Ultra-low-power 32-bit ARM core debuts

Headlines for Monday, June 18, 2012

Business

Ford test drives Android in Silicon Valley lab

Intel to pay $375M for 1,700 InterDigital patents

IHS India: Cache SSDs vs. hybrid HDDs in ultrabooks

Slideshow: GlobalFoundries expanding in Dresden

Qualcomm buys power IC vendor Summit Micro

Dresden fab could host 20-nm process, 450-mm wafers

Ramtron rejects Cypress Semi offer

OLEDs are hitting their stride this year in all segments

Cray will use Intel MIC, branded Xeon Phi

Europe asks if it is time for an 'Airbus of chips'

IBM re-takes lead in Top 500 computers

Technology

Emerging battery techs slowly entering mainstream

Product

Six-axis sensor fuses accelerometer with magnetometer

Headlines for Friday, June 15, 2012

Business

BMW: Silicon Valley honks at Detroit

Large capacity LiFePO4 batteries require high power chargers

Technology

Xilinx to demo All Programmable OTN Solutions

Research project to avoid rare-earth metals for electric motors

Design

Chinese RF chip vendor Nationz licenses MIPS32 M4K cores

Headlines for Thursday, June 14, 2012

Business

Via preps 20-member LTE patent pool

Silicon Valley Bank gears up China venture

Awinic, China fabless, flourishes by mimicking Huawei work ethic

T-Mobile gears up LTE Release 10 network

Nokia job cuts don't and won't impress anyone

Hard disk drive revenue set record in Q1

Power IC vendor taps Dongbu HiTek's analog process

Nokia to cut 10,000 jobs, divest assets

Imec, Panasonic R&D collaboration to include flexible electronics

Soitec completes CPV solar plant in Italy

Technology

First look: TI shows off Win RT on Toshiba tablet

Design

Qualcomm, Lantiq team on home gateway reference design

Teardown: Inside the Samsung Galaxy S3 smartphone

Headlines for Wednesday, June 13, 2012

Technology

TI details TSV integration in 28-nm CMOS

Startup preps phased array satellite system

AMD looks smart in the brain engineering era

AMD to integrate ARM core into APUs

IMEC reports on gate-last HKMG options

Design

Toshiba shows first SCSI-like Universal Flash demo system

Business

Apexone: Here comes muPad from Shanghai

Toshiba shines in Q1 NAND rankings