Latest News

Headlines for Monday, July 2, 2012

Business

Drone 'code of conduct' targets safety, privacy concerns

Analyst lowers chip market forecast for 2012

Infineon leads power chip market ranking, says IMS

Micron confirms Elpida deal, also plans Rexchip purchase

China, U.S. lead innovation, Europe nowhere, says survey

Technology

Embracing 'superstack' model is a matter of survival

Terahertz emitter harnesses 45-nm CMOS

Researchers try vacuum transistors at low voltage

Product

Power management gauge measures multi-cell batteries

Headlines for Friday, June 29, 2012

Business

DoD's dubious achievement awards

Novaled expands agreement with Samsung Mobile Display

Newport Media gets the ISDB picture in smartphones

Technology

UMC licenses IBM technology for 20-nm FinFETs

Headlines for Thursday, June 28, 2012

Technology

Future of CMOS hinges on mobile apps

Litho firm buys packaging patents from IBM

Business

Micron reportedly strikes $2.5B deal for Eplida

Marvell aims to be China chip leader

On Qualcomm's manufacturing options

Report: Qualcomm wafer fab not ruled out

U-blox makes LTE move, buys Cognovo and 4M Wireless

Product

Nordic streamlines code in latest RF chips

Headlines for Wednesday, June 27, 2012

Business

Legislation seeks to relax restrictions on tracking fake chips

Bourns buy of Jensen Devices opens auto lamp play

Google launches 7-inch, $199 Android tablet

U.S., European manufacturers join forces to compete with China

Maxim pledges $200M boost for U.S. chip making

Indian fabless startup seeks engineers, money

Court halts U.S. sales of Samsung's Galaxy Tab 10.1

Technology

Researchers report solid-state quantum leaps

Displayport, HDMI duel over mobile links

Google neural network teaches itself to identify cats

CEA-Leti preps for PCM, HKMG research below 20-nm

Intel announces another university research center

Design

Wire insulation enables relaxed design rules

Extra!

Avnet: China fabless sector needs stimulus, education

Product

Applied tips dielectric etch tool for 3-D NAND production

MediaTek to bring premier smartphone features to $150 - $200 handsets

AMD rolls low-power embedded APU

Financial

Infineon lowers guidance as business softens

Headlines for Tuesday, June 26, 2012

Product

2x2mm MEMS microphones delivered in tough plastic packages

ST starts sampling STM32 F3 microcontroller range

Business

PV gross margins fell 75% in Q1

Wolfson wins audio slot in Samsung smartphone

Quantum film firm InVisage appoints Madavi chairman

Why TI does MCU designs in Shanghai

Extra!

Q&A: Chip design not keeping pace in mobile

Conferences & Shows

Virtual jobs fair offers engineers work in Singapore

Design

Dow Corning and Suss cooperate on making 3-D TSV chips

Imec, Murata team on reconfigurable radio IC design

Technology

Slideshow: Scenes from the FTF 2012 Tech Lab