Latest News

Headlines for Sunday, July 8, 2012

Technology

Sixty percent of new cars will be connected by 2017

Global tablet usage for viewing TV/Video content doubles year on year, says NPD DisplaySearch

In-car information deluge raises concerns of driver distraction, analyst says

One in every five wearable wireless devices set for healthcare deployment by 2017

World's first Bluetooth low energy bike speed and cadence monitor is released

Audi, Sierra Wireless jointly develop and test in-vehicle LTE infotainment system

Search engine aims to quiz sensor networks

Smart TV surges in popularity worldwide, China at the forefront

Headlines for Friday, July 6, 2012

Business

NXP Semi CTO steps down

4 keys to succeeding in cloud services

Derecho exposes our fragile networks

Emulex pays Broadcom $58M in patent deal

TI, Stanford explore OpenFlow silicon

Touchstone targets 'everything in signal path'

Report: Supply chain mobilizes to make iPad Mini

Chip executives' conference relocates to Bratislava

Product

Aeroflex offers 16-Mbit, 64-Mbit rad-hard MRAMs

Tools expand for sensor fusion hubs

MEMC introduces SOI wafers for FinFET over oxide

Financial

Konarka files for bankruptcy protection

Headlines for Thursday, July 5, 2012

Design

Teardown: Inside Google's Nexus 7 tablet

Business

Russian component market to grow 9.5% in 2012, says study

Ramtron rejects Cypress again, in talks with others

Toshiba fined $87 million for LCD price-fixing

Technology

Nuclear fusion research aids EUV source breakthrough

Study assesses material constraints for concentrating solar power

Soap film forms textured display screen

Headlines for Wednesday, July 4, 2012

Business

MEMS market to show 13% CAGR to 2017, says Yole

Has ARM won the processor wars? Hardly!

Xilinx to recruit engineers in $50 million Irish expansion

Report: TSMC's Chang says no to buying Renesas fab

A Hitchcockian nightmare: Europe falling off a cliff

Chip market still shrinking versus 2011, says SIA

Product

Advantech aims boards at the Internet of Things

Technology

ST supports study lab in northeast China

ARM, HP, SK Hynix join Hybrid Memory Cube group

Updated: Scientists to push organic solar cell efficiency

Headlines for Tuesday, July 3, 2012

Business

Memo to Corporate America: 'Skills gap' is closing

A view from Norway on the Internet of Things

Intel begins appeal against $1.3 billion European fine

Broadcom extends MIPS deal but does not buy firm

Packaging takes front and center stage

Toumaz buys radio chip firm for $50 million

Analysts find May was weak month for chip market

Cadence pays $80 million to buy signal integrity firm

Qualcomm signs UMC, Samsung for 28-nm chips, says report

Technology

Enea completes migration to Linux OS

Plastic Logic demos flexible color moving display

Headlines for Monday, July 2, 2012

Business

Drone 'code of conduct' targets safety, privacy concerns

Analyst lowers chip market forecast for 2012

Infineon leads power chip market ranking, says IMS

Micron confirms Elpida deal, also plans Rexchip purchase

China, U.S. lead innovation, Europe nowhere, says survey

Technology

Embracing 'superstack' model is a matter of survival

Terahertz emitter harnesses 45-nm CMOS

Researchers try vacuum transistors at low voltage

Product

Power management gauge measures multi-cell batteries