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Headlines for Tuesday, December 11, 2012

Business

MediaTek targets Qualcomm with quad-core/modem SoC

Huawei, spurned by U.S., expands in Europe

Renesas eyes foreign CEO, nominations welcome

Micron reportedly preps Israel job cuts

Yoshida in NY: Can ST-Ericsson shrink to survive?

Technology

IBM paves way for wearable electronics, folding displays

SuVolta reports 65nm parameter results at IEDM

Toshiba claims MRAM can replace SRAM

28-nm FDSOI is production ready, says ST

IEDM: Moore’s Law seen hitting big bump at 14 nm

Product

Intel leapfrogs ARM (for now) with Atom server SoC

Headlines for Monday, December 10, 2012

Technology

MIT integrates InGaAs in 22-nm design flow

IBM, Intel face off at 22 nm

Pacemaker was born of a blackout

Intel's 22-nm tri-gate SoC, how low can you leak?

IEDM goes deep on 3-D circuits

ST voices new strategy, recommits to fully depleted SOI

Business

Imagination raises bid for MIPS

STEM, manufacturing and closing the 'skills gap'

TSMC November sales show signs of weakness

Top 10 smartphone gadgets & apps

Dell’Oro surveys small cells, carrier Wi-Fi, optical nets

ST-Ericsson vows to keep working on turnaround

ST to exit ST-Ericsson in 2013

London Calling: Russia must deliver on tech investment

Career

ARM founder sees startups hustling in hard times

Headlines for Sunday, December 9, 2012

Technology

Global cellular M2M connections to grow to over 325 million by 2016

Wireless LAN market posts record quarter revenues

Renesas puts smart home operating system into play

Headlines for Friday, December 7, 2012

Business

Power management market is in decline in 2012

Yoshida in China: Probing Apple's U.S. manufacturing gambit

AMD recasts foundry deal to save cash

Carrier Wi-Fi, optical net markets are booming

Intel upping Atom ante

Report: China approves ARM venture with conditions

Earthquake, tsunami strike Japan's northeast

Technology

Voyager: Electronics for the long haul

Headlines for Thursday, December 6, 2012

Technology

3-D printers for medical use ahead says researcher

Innovation for a disruptive world

Intel to detail tri-gate advances at IEDM

Business

Marvell co-founder: RIM will survive, thrive

Broadcom sees rising 20 nm costs amid handset push

MIPS rolls architecture extensions amid bidding war

Medtech prize, wireless FDA unit proposed in bill

We should pay for patents by the pound

Sony, Toshiba expected to spend more on chips

Broadcom lifts Q4 sales target

Yoshida in NY: Too late to save Nokia?

Headlines for Wednesday, December 5, 2012

Business

Top 10 electronics business deals of 2012

EU levels record antitrust fine on electronics firms

Qualcomm overtakes TI in chip sales rankings

Yoshida in China: Nokia TD-SCDMA phones might bite Apple

Dear Electronics Industry, Status of EETimes Print

PMC’s Lang talks of comms, storage and mergers

Global chip sales stay strong in October

Nokia selling headquarters for $223 million

Technology

Opinion: A graduate-entrepreneur looks forward 40 years

London Calling: At IEDM, heat improves flash memory