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Latest News

Tuesday, December 11 -- Monday, December 17

Headlines for Monday, December 17, 2012

Business

Kurzweil joins Google as director of engineering

Yoshida in China: Demystifying Apple’s iPhone 5 launch

Qualcomm, Broadcom climb in chip company ranking

Top 10 shifts in chips, comms

Imagination raises MIPS bid

Technology

PLX, Kontron drive PCIe backplane to 5.6 GB/s

John McCollum: HS teacher taught electronics with love

London Calling: Intel Labs drives Digital Europe

Lithography experts remain skeptical about EUV


Headlines for Saturday, December 15, 2012

Technology

IBM provides Russia with 90-nm process

Altera eyes FDSOI process for FPGAs


Headlines for Friday, December 14, 2012

Technology

Samsung proceeding to expand Austin fab

10 Tech Gifts to Buy Your Engineer for Christmas

Ireland still set for FinFETs, says Intel exec

Business

Chip sales slide in Q4 amid inventory, pricing gloom

Apple could ship 100M iPads in 2013

Chip market rebound coming, survey says

Product

Lattice ship 15 million iCE FPGAs and counting…

Aldec supports ARM Cortex-A9 in HES-7 ASIC prototyping platform


Headlines for Thursday, December 13, 2012

Business

Foundries not dead, just evolving, says Globalfoundries CEO

Meeting Zuckerberg and Mr. EUV

Yoshida in China: Will MediaTek’s luck hold in 2013?

Technology

Intel's FinFETs approach draws fire from rivals


Headlines for Wednesday, December 12, 2012

Technology

London Calling: Could gate-switched FDSOI win?

FDSOI roadmap renames next node as 14-nm

IBM details 3-D server chip stacks

Business

Device manufacturers' 'Holy Trinity'

London Calling: Whither ST?


Headlines for Tuesday, December 11, 2012

Business

MediaTek targets Qualcomm with quad-core/modem SoC

Huawei, spurned by U.S., expands in Europe

Renesas eyes foreign CEO, nominations welcome

Micron reportedly preps Israel job cuts

Yoshida in NY: Can ST-Ericsson shrink to survive?

Technology

IBM paves way for wearable electronics, folding displays

SuVolta reports 65nm parameter results at IEDM

Toshiba claims MRAM can replace SRAM

28-nm FDSOI is production ready, says ST

IEDM: Moore’s Law seen hitting big bump at 14 nm

Product

Intel leapfrogs ARM (for now) with Atom server SoC


EETimes 40th Anniversary iPad App
EETimes 40th Anniversary iPad App celebrates the visionaries, technologies, and events which have defined the electronics industry.


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