Latest News

Headlines for Tuesday, December 18, 2012

Business

Fab spending decline to continue in 2013

Apple, Nvidia may stack graphics for Macs, iPads

AMOLEDs on growth path with hurdles

ARM security, payment JV launches as Trustonic

Technology

Globalfoundries mulls third manufacturing option

400-Gbit Ethernet effort kicks off in March

Headlines for Monday, December 17, 2012

Business

Kurzweil joins Google as director of engineering

Yoshida in China: Demystifying Apple’s iPhone 5 launch

Qualcomm, Broadcom climb in chip company ranking

Top 10 shifts in chips, comms

Imagination raises MIPS bid

Technology

PLX, Kontron drive PCIe backplane to 5.6 GB/s

John McCollum: HS teacher taught electronics with love

London Calling: Intel Labs drives Digital Europe

Lithography experts remain skeptical about EUV

Headlines for Saturday, December 15, 2012

Technology

IBM provides Russia with 90-nm process

Altera eyes FDSOI process for FPGAs

Headlines for Friday, December 14, 2012

Technology

Samsung proceeding to expand Austin fab

10 Tech Gifts to Buy Your Engineer for Christmas

Ireland still set for FinFETs, says Intel exec

Business

Chip sales slide in Q4 amid inventory, pricing gloom

Apple could ship 100M iPads in 2013

Chip market rebound coming, survey says

Product

Lattice ship 15 million iCE FPGAs and counting…

Aldec supports ARM Cortex-A9 in HES-7 ASIC prototyping platform

Headlines for Thursday, December 13, 2012

Business

Foundries not dead, just evolving, says Globalfoundries CEO

Meeting Zuckerberg and Mr. EUV

Yoshida in China: Will MediaTek’s luck hold in 2013?

Technology

Intel's FinFETs approach draws fire from rivals

Headlines for Wednesday, December 12, 2012

Technology

London Calling: Could gate-switched FDSOI win?

FDSOI roadmap renames next node as 14-nm

IBM details 3-D server chip stacks

Business

Device manufacturers' 'Holy Trinity'

London Calling: Whither ST?