United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 


Price concerns could take bite from Bluetooth
Print this article Email this article Reprints RSS Digital Edition

EE Times


Cutting the cord on wired devices has captured the industry's imagination and inspired large investments in Bluetooth. Bluetooth may be the answer for wireless LANs, allowing mobile computers to roam freely. But what of PANs-personal-area networks in the 1- to 3-meter space-where low cost and low power dominate decision criteria? Can the PAN support the price and power consumption of a Bluetooth node?

Micrologic Research reports that the OEM cost to implement a Bluetooth node in 2001 is $26.65, ramping down to $13.15 by 2005. The end-user shelf price is a multiple, depending on levels of distribution, profit margins, and threshold market prices (TMPs) consumers are willing to pay.

TMP is one of the most important factors for high-volume consumer products such as MP3 players, cell phones, videogame systems, wireless headsets, PDAs and in-the-car information systems. The $199, $99, $39 and $19.99 watermarks make instant decisions possible for high-tech consumer products. When there is drift above the watermark consumers wait, assuming prices will ultimately come down.

It takes two to tango, or two wireless nodes to define a point-to-point network like a wireless headset and cell phone. The OEM cost for two nodes of Bluetooth is then $53.30 ($26.30 in 2005), which translates to a shelf price of $148 ($73 in 2005) at 40 percent OEM margin and one level of distribution (40 percent) margin. That's a lot just to cut the cord.

A Bluetooth-enabled wireless headset accessory for cell phones has hit the shelf at about five times the price of competing, non-Bluetooth wireless solutions. It requires two wireless nodes for the point-to-point network: a Bluetooth base unit that plugs into the bottom of the phone and the headset.

Products above TMP have a difficult time driving the market if suitable competing products are already at or below TMP. There is a pent-up demand to cut the cord, so consumers will be willing to pay some premiums over wired solutions. As the market drives TMP down over time, it remains uncertain that Bluetooth-enabled products will ever intersect the declining TMP for high-volume, low-cost, consumer products.

Competing or coexisting technologies, depending on the application, are primarily based on infrared, IEEE 802.11, IEEE 802.15 and a new non-RF magnetic-induction-based communication system. IR is a line-of-sight technology for point-and-shoot applications with no multipoint capability. LAN products based on the IEEE specifications are well positioned to meet their high-bandwidth and moderate-distance goals. Magnetic induction is a good fit for PAN applications where low power, small form factor and low price are the drivers.

The PAN is a unique space within the world of wireless connectivity and needs new technology if wireless solutions are to slip below TMP. Success requires breaking down technological barriers and creating affordable solutions.

Alan Swahn is Vice President of sales and marketing at Aura Communications Inc. (Wilmington, Mass.).





The views and opinions expressed in this column are strictly those of the author and should not be taken as an editorial position of EE Times or any of its other editors, publications or Web sites.


  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Looking for a new job?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
SRC Expands R&D Centers
The Semiconductor Research Corp has added a new center to its university R&D efforts.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.


All White Papers »   

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About