United Business Media EE Times


Search

HOMEMARKET INTELLIGENCE UNITFORUMSDESIGNNEW PRODUCTSCAREERSBLOGSCONTACTEVENTSSIGN UP!RSSMost Popular contentTrusted Sources

 


Foundry ASMC defies downturn
Print this article Email this article Reprints RSS Digital Edition

EE Times


CLENDENIN_MIKE

Times may be bad for most of Asia's foundries, but not for China's Advanced Semiconductor Manufacturing Corp. The Shanghai company's trailing-edge fabs are fully utilized, its 8-inch expansion is ahead of schedule, and there's talk of an IPO and maybe, just maybe, a 12-inch fab in a few years.

It appears that news of the downturn hasn't yet reached AS-MC's part of Shanghai.

By November, ASMC will be running phase 1 volume production (5,000 wafers/month) at an 8-inch wafer fab capable of 0.25-micron processes. It plans to increase output to 10,000 wafers per month in early 2004 and to 30,000 eventually. "At this moment, the phase 1 capacity is already sold out," said Gao Zhou Miao, vice president of operations at ASMC.

The company was one of the early movers in China, starting in 1995 as a joint venture between the Netherlands' Royal Philips Electronics N.V. and the Chinese government. For years, it has run two wafer fabs: one for bipolar devices on 5-inch wafers and the other a CMOS line running 6-inch wafers.

ASMC has survived, and grown, in the ups and downs of the market by having Philips as a benefactor and by specializing in analog chips, power ICs, E2PROMs and 8-bit microcontrollers. "We focus on our niche markets. That's our long-term strategy, and we are not going to change that," Gao said. "Of course, the niche market itself may change, and if we see some new opportunities will pursue them. But we don't think we are competing with TSMC or UMC on those leading-edge technologies."

As the cell-phone market burgeons in China, ASMC is positioning its 8-inch fab as a local source for cellular chips. Earlier this year, Jazz Semiconductor Inc. said it would swap its mixed-signal and radio-frequency technologies, in-cluding BiCMOS and silicon-germanium BiCMOS process technology, for capacity at ASMC's new 8-inch fab.

Indeed, in a local market that is fast becoming saturated with fabs, Gao said ASMC is capable of surviving any shakeout. Profits were up about 50 percent in 2002, Gao said, and even though its 8-inch line is nearing completion, the company is also considering a small expansion at its trailing-edge fabs, which similarly underwent a small boost last year.

"One of the problems we have now is too many projects. We are hiring more and more integration engineers and trying to ramp capacity," he said.

Taiwan Bureau Chief Mike Clendenin can be reached at mclenden@cmp.com

http://www.eet.com





The views and opinions expressed in this column are strictly those of the author and should not be taken as an editorial position of EE Times or any of its other editors, publications or Web sites.


  Free Subscription to EE Times
First Name Last Name
Company Name Title
Email address
  Click here for your Free Subscription to EETimes Europe
 
CAREER CENTER
Looking for a new job?
SEARCH JOBS
SPONSOR

RECENT JOB POSTINGS
CAREER NEWS
SRC Expands R&D Centers
The Semiconductor Research Corp has added a new center to its university R&D efforts.

For more great jobs, career related news, features and services, please visit EETimes' Career Center.


All White Papers »   

 
Education and
Learning


Learn Now:












Home | About | Editorial Calendar | Feedback | Subscriptions | Newsletter | Media Kit | Contact | Reprints|  RSS|   Digital|  Mobile
Network Websites
International
Network Features




All materials on this site Copyright © 2009 TechInsights, a Division of United Business Media LLC All rights reserved.
Privacy Statement | Terms of Service | About