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posted in April 2012

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Smart memory seen as cure for user-interface bottlenecks
News & Analysis  
4/30/2012   4 comments
Spansion CEO John Kispert said smart memory will be needed to wean advanced user-interfaces off cloud connectivity dependence.
Intersil's chip set enables Micron Tech LCOS display
News & Analysis  
4/25/2012   4 comments
Intersil's mixed signal chip set targets novel pico-projector applications with a reference design using Micron Technology's liquid crystal on silicon display.
Comment: re: Wafer inspection gets smart - 4/25/2012
Broadcom aims to spread 100-Gbit Ethernet with single-chip solution
Product News  
4/25/2012   7 comments
Broadcom announced its fourth-generation Ethernet network processor, which it claims is the industry's first chip to use massive parallelism by virtue of its 64 packet-processing cores running at one gigahertz. Providing full-duplex 100Gbit per second performance, it can also be configured to provide a dozen 10-Gbit channels.
Tensilica aims at Chinese audio
News & Analysis  
4/24/2012   2 comments
Tensilica is banking its future growth on the world's largest electronics market by adding support for China's Dynamic Resolution Adaptation standard to its entire library of over 100 audio encoders, decoders, an sound enhancement chips for adding high-fidelity audio digital signal processors to mobile handsets.
3-D FPGAs enable silicon convergence
News & Analysis  
4/24/2012   7 comments
Altera says its three-dimensional FPGAs can incorporate a host of traditionally discrete components to boost system performance and minimize power consumption.
Freescale ups ante with quad-core Qorivva
Product News  
4/24/2012   4 comments
Freescale Semiconductor said its new quad-core Qorivva MPC5746M microcontroller boost performance up to 5-times plus includes specialized circuitry for safety, security and input/output including on-chip Ethernet.
Wafer inspection gets smart
News & Analysis  
4/23/2012   1 comment
By adding intelligent parallel processing, KLA-Tencor Corp. (Milpitas, Calif.) has increased the throughput of its wafer inspection and metrology tool by as much as four times.
Startup claims 'Holy Grail' of SoC design
News & Analysis  
4/23/2012   23 comments
Startup Algotochip claims to have achieved the Holy Grail of chip design: the ability to create complete system-on-chip designs from a C-code specification and test stimulus vectors in eight to 16 weeks.
IBM demos terahertz graphene photonics
News & Analysis  
4/22/2012   4 comments
IBM demonstrated a graphene/insulator superlattice that achieves a terahertz frequency notch filter and a linear polarizer, devices which could be useful in future mid- and far-infrared photonic devices including detectors, modulators and three-dimensional metamaterials.
The intangible assets of the Internet of Things
News & Analysis  
4/16/2012   21 comments
With everything electronic poised to get its own IP address, the challenge is unlocking the value in the Big Data of the Internet of Things.
Silicon-on-insulator at ST and IBM closing gap with Intel
News & Analysis  
4/16/2012   17 comments
Wafer maker Soitec claims that semiconductor manufacturers can catch up with Intel by switching to its Silicon-on-insulator wafers, a ploy that has already convinced STMicroelectronics, Erikson and IBM.
Research consortium claims solution for multi-core scaling
News & Analysis  
4/16/2012   2 comments
Designers can relax about massive multi-core processor design now that the Semiconductor Research Corp. has proven that a simple switch to hierarchical directories will enable up to 512 core per processor.
Mesh net ties Internet-on-a-chip with multi-cores
News & Analysis  
4/11/2012   7 comments
On-chip busses and ring toplologies in use today will be more trouble than they are worth, making on-chip mesh networks the preferred architecture for massively parallel processors, according to according to researchers at the Massachusetts Institute of Technology (MIT).
Graphene composite beats copper for cooling chip
News & Analysis  
4/11/2012   14 comments
Carbon is predicted to replace semiconductors, conductors and even insulators in future electronic devices and its already happening one application at a time. The most recent conquest by pure crystalline carbon--graphene--is a new composite material that offers a more efficient and less expensive way of cooling electronic devices than copper alone.
EDA tools aims at 10-nanometer 3-D
Product News  
4/9/2012   1 comment
Coventor's SEMulator3D enables new physical design techniques at advanced nodes to be designed in software to speed up and increase the reliability of new the necesary new novel structures such as 3-D FinFETs.
ISPD: Semiconductors aim for 8-nm node
News & Analysis  
4/6/2012   6 comments
Presenters discussed the path forward to 8-nanometer production technology at the International Symposium on Physical Design last week in Napa, Calif.
IBM analytics to plumb universe's secret
News & Analysis  
4/2/2012   9 comments
IBM will harness water-cooled 3-D chip sets to plumb the secrets of the universe by analyzing exabytes (billion gigabytes) of data streaming in from the world's largest radio telescope to be constructed in 2024.

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