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R_Colin_Johnson
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posted in May 2011

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High-temp MEMS goes seismic
News & Analysis  
5/26/2011   4 comments
Analog Devices claims to have designed the world's first MEMS chip that can tolerate temperatures as high as 342 degrees Fahrenheit.
IBM to test wafer pruning
News & Analysis  
5/25/2011   10 comments
IBM will test a wafer pruning technique developed at the University of California at Los Angeles said to spot bad wafers early with test structures in-between die that can reject wafers before costly metallization steps.
Plastic optics boosted to 25 Gbit/s
News & Analysis  
5/23/2011   1 comment
Scientists at the Georgia Institute of Technology reporting successful operation of s new vertical-cavity surface-emitting laser technology from VI Systems at 25 Gbits per second.
Algae powers hydrogen economy
News & Analysis  
5/20/2011   16 comments
Algae can produce hydrogen fuel from water and sunlight, with a little boost from man-made nanoparticle catalysts, according to engineers at the U.S.Department of Energy's Argonne National Laboratory.
Activated graphene boosts supercaps
News & Analysis  
5/18/2011   3 comments
An activated form of graphene developed by the University of Texas-Austin, modeled on the activated carbon in filters, aims to boost supercapacitors enough to rival batteries in hybrid vehicles.
Silicon Labs aims to be one-stop timing shop
News & Analysis  
5/17/2011   3 comments
Silicon Laboratories recently unveiled its long-term strategy to dominate the timing chip market following its acquisition of MEMS oscillator maker Silicon Clocks and traditional timing chip maker SpectraLinear.
HP discovers memristor mechanism
News & Analysis  
5/16/2011   16 comments
Hewlett Packard uses synchrotron radiation to unearth the switching mechanisms inside its titanium oxide memristor to reveal how it can switch as fast as DRAM and yet retain its memory millions of times longer than flash.
ADI names three new Fellows
News & Analysis  
5/12/2011   Post a comment
Analog Devices has conferred the title of Fellow--its highest technical honor--on three engineers who have made invaluable contributions to electronics.
High-def, glasses-free 3-D debuts
News & Analysis  
5/11/2011   4 comments
MIT proposes an alternative parallax barrier method of 3-D displays that offer easier, glasses-free viewing plus higher resolution.
Graphene modulator tackles optics
News & Analysis  
5/10/2011   7 comments
A graphene modulator capable of downloading an movie into a smartphone in seconds can be smaller, cheaper and faster than today's optical communications devices according to researchers at the University of California-Berkeley.
MEMS touted for telecomm, embedded apps
News & Analysis  
5/9/2011   2 comments
Micro-electro-mechanical systems enter high-precision timing applications with voltage-controlled oscillators appropriate for telecom, wireless, networking and embedded computing applications.
Lab aims for superconducting FET
News & Analysis  
5/6/2011   3 comments
Researchers inched closer to understanding superconductivity with the creation of special field-effect thin films that aim for superconducting FETs.
New IBM Fellows push computing frontiers
News & Analysis  
5/4/2011   1 comment
IBM honored eight new Fellows for their pioneering work in cloud, stream, grid, network and supercomputing, including the Watson super that beat human champs at Jeopardy.
Freescale mechatronics contest taps Tower-powered FreeBots
News & Analysis  
5/3/2011   2 comments
In Freescale's Make It Challenge, announced at ESC Silicon Valley, engineers will use a free robot studded with Freescale sensors to create a unique mechatronics application.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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