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Commodore0
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3D Memory Chips May Beat 3D Hybrid Memory Cube
News & Analysis  
9/30/2015   Post a comment
A memory chip goes beyond Micron's 3D Hybrid Memory Cube by doubling the number of memory die to eight, but now its adding analog, mixed signal, MEMS and the sensors to the mix--enabling systems-on-chip to pack at lease 18 layers into the same footprint of its Integrated Sensor Platform.
6 Keys to Navigating Connected Car's Software Quagmire
News & Analysis  
7/8/2014   11 comments
The rush to achieve connected cars has thrown the automotive industry into a technological quagmire. EE Times dissects the technological building blocks and lays out who the players are and who benefits most.
MEMS Microphones Busting Out All Over
Slideshow  
6/24/2014   16 comments
Once portrayed as a dead-end market destined to become a mere commodity where the most important parameter was cost, MEMS microphones today are driven by smartphones/tablets/laptops with IoT/wearables/automotive quickening pace. MEMS mics' added value has no bound in sight.


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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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