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7|15|2016 SAN FRANCISCO — The next-generation car — highly connected and possibly autonomous — has been called by many names. “Smartphone on ...

7|14|2016 LONDON—The worldwide semiconductor manufacturing equipment market will be flat this year and will rebound in 2017 according to the SEMI trade association.

7|14|2016 SAN FRANCISCO—Leti, a CEA Institute, came to Semicon West here this week to unveil its second generation 3D Network-on-Chip (3D-NoC) technology.

7|12|2016 Microsoft kicked off its Worldwide Partner Conference (WPC) on July 11 in Toronto. During the first day of keynotes, executives highlighted several prominent ...

7|12|2016 SAN FRANCISCO—PC shipments increased in the second quarter compared with the second quarter of 2015, the first year-over-year increase for the U.S. PC ...

7|11|2016 STMicroelectronics has introduced a development ecosystem for its latest low-power, high-performance STM32L4 microcontrollers (MCU) and expanded the ...

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Because EE Times' sister publication, EDN, is having a 60th anniversary, I've been skimming through old print issues. Some of them even had their own quizzes. For this ...
Many companies are under pressure to deliver products to market faster so as to achieve the longest time in the market. This has led companies designing complex FPGAs to ...
This is a story about a man who shall remain nameless. (Some refer to him as being magnificent, but that's neither here nor there.)
The cover of the September 19, 1985 issue of EDN showed Tektronix oscilloscope covered with airline tags and stickers from numerous countries. "Well-traveled ...
My mind is currently churning with thoughts about the potential uses of various forms of virtual and augmented realities (VR and AR), all sparked by my recent acquisition ...
A couple of days ago I received a message from an embedded software engineer who hails from Barcelona in Spain. We'll call this young fellow Gonzalo Serrano Pérez (because ...
Editor's Note: Dr. Lauro Rizzatti recently moderated a discussion on hardware emulation deployment modes with Alex Starr, AMD fellow at AMD; Guy Hutchison, Cavium's ...
Last week in Part 1, we covered some DMMs featured in a 1982 EDN article "Intelligent Instruments" by Gary Chesnutis in the March 3, 1982 issue. This ten-page article ...

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What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

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