SAN JOSE, Calif. -- Qualcomm Inc. claims that it has made the first phone call on a 3G chip manufactured with 45-nm process technology, with a 40-nm device in the works.
The undisclosed device from Qualcomm was made on a foundry basis by Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). TSMC is one of Qualcomm's foundry partners. Recently, TSMC rolled out its 45-nm process.
Qualcomm (San Diego) recently taped out the device. It is made using 193-nm immersion lithography and extreme low-k inter-metal dielectric material.
The company is also developing 40 nm process technology, which should deliver even greater benefits in semiconductor performance, cost and efficiency, according to Qualcomm.
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