LONDON — Sematech, a consortium of semiconductor manufacturers, has announced the appointment of Daniel Armbrust to serve as its president and chief executive officer. Armbrust, who served most recently as vice president of 300-mm semiconductor operation at IBM Corp., will succeed Michael Polcari, who has been appointed Sematech's chairman of the board.
Armbrust, 47, was responsible for IBM's 300-mm wafer fab in East Fishkill, New York. Previously Armbrust held a variety of positions at IBM related to process development, manufacturing, and client engagement. Armbrust will assume his new duties immediately,
Armbrust previously spent 25 years at IBM. Armbrust earned a bachelor's degree in ceramic science and engineering from Pennsylvania State University as well as an M.Sc. degree in manufacturing systems engineering from Rensselaer Polytechnic Institute.
Related links and articles:
www.sematech.org
Sematech tips 450-mm fab, platform tool specifications
IMEC names Van den Hove as president, CEO
Sematech, IBM, Intel, Marcy form R&D venture
RSS
RSS| 
Digital| 
Mobile
