Grabbe, an IEEE life fellow, pioneered work that has produced nearly 500 U.S. and foreign patents, covering machine design, semiconductor packaging, electronics assembly and optoelectronic conductor design. His work in printed-circuit board technology for electronics packaging led to the development of large, multilayer pc boards, which proved crucial in helping U.S. astronauts gain greater real-time control of their space exploration activities.

"For the last 50 years, [Grabbe] has been a leader in creating new products and new manufacturing approaches that have accounted for many significant improvements," according to the peer who nominated him for the award.

Grabbe is now a researcher on gyroscopes and accelerometers at the Center for Holographic Studies and laser micromechatronics at Worcester Polytechnic Institute in Massachusetts.

The award, presented annually since 2004, is given to an individual or a small team involved in device and systems packaging, including packaging of microelectronics, optoelectronics, RF and wireless, and microelectromechanical systems (MEMS). The IEEE Components, Packaging and Manufacturing Technology (CPMT) Society oversees the award selection.