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Micron, Hynix push out NAND fabs
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EE Times


SAN JOSE, Calif. — A downturn in the NAND flash market is forcing many vendors to cut production or delay their fabs.

Micron Technology Inc. has pushed out the production of a proposed fab in Singapore, while rival Hynix Semiconductor Inc. plans to cut NAND production. Market leaders Samsung Electronics Co. Ltd. and Toshiba Corp. are reportedly not cutting NAND production, according to reports.

Micron made the disclosure after reporting a $777 million loss in the quarter. ''Management said it is pushing production at Singapore NAND fab from 2H '08 to 1H '09 due to current market conditions,'' said Daniel Amir, an analyst at Lazard Capital Markets. The Singapore fab is part of a joint NAND venture with Intel Corp., dubbed IM Flash Technologies LLC.

The delay could give the market some relief, however. ''We see this positively for the industry in general, as it is another data point (in addition to Hynix cutting production) suggesting that supply-demand in 2H '08 could improve,'' Amir said in a report.

Hynix of South Korea planned to move into NAND production in a new 300-mm fab, dubbed M11. Hynix will push out that production to the third quarter from the second, according to The Wall Street Journal. Hynix will shut down another NAND fab, M9, in the third quarter in a move to reduce output, according to the report.



Related Links:

  • Micron's loss widens amid flat sales
  • iSuppli cuts NAND outlook, sees downturn
  • Slower ramps seen for NAND fabs



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