STATS ChipPAC has been on a production ramp with wafer-level packaging services and more than doubled its production volume in 2008. It intends to continue to expand its Singapore wafer-level operation and is on track to achieve another 50 percent increase in wafer-level capacity by the third quarter of 2009.

Wafer level packages differ from laminate and leadframe based packages in that all of the process steps are performed at the wafer level prior to the singulation of the die from the wafer. Full turnkey wafer level packaging includes wafer bump, test and die level services such as tape and reel.

STATS ChipPAC's wafer-level packaging solutions include technologies for wafer repassivation, redistribution and IPD layers combined with electronics industry preferred lead free SAC alloys in both fine and large pitch applications. Additionally, a complete turnkey process flow is available with flexible backend assembly capability supporting high volume wafer sort, automatic optical inspection and backend processing of bare die into tape and reel or waffle pack.