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Intel files complaint against Via with ITC
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TAIPEI, Taiwan — In an attempt to halt sales of some Via Technologies Inc. core logic, Intel Corp. has filed a patent-infringement complaint against Via and its customers with the U.S. International Trade Commission (ITC). The complaint contends that Via is improperly using Intel's P6 front-side bus in many of its current chip sets.

Intel has filed patent infringement cases against Via Technologies in the United States, England and Singapore over Via's use of the P6 front-side bus. The earliest of these cases will being in England in October 2000, and the various cases could drag on for years. Meanwhile, Via is increasing its share of the chip set market as Intel has introduced no clear replacement for its once dominant, but now discontinued, BX chip set.

On Intel's behalf, the law firm of Howrey & Simon filed a "337 Complaint" against Via with the ITC on Jan. 7. The complaint is in the form of a letter to Donna Koehnke, secretary of the U.S. ITC, and requests that the ITC investigate "certain integrated circuit chip set and the products containing the same." The complaint cites section 337 of the Tariff Act of 1930.

Uncertain impact

"This could be very harmful for Via," said one securities analyst in Taiwan. "On the other hand, it could be like the attempted trade sanctions against Taiwanese SRAM and DRAM manufacturers and turn out to not have much impact at all."

Though both Intel and Via officially have no comment on the ITC complaint, sources close to the situation said the complaint is against Via and its increasingly large number of customers. The ITC could begin proceedings regarding the case as quickly as two to three weeks from now.






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