WASHINGTON — The proposed third iteration of the double-data-rate DRAM standard would seek to cover a range of new mobile wireless devices beyond PCs and servers, an industry standards group said.
The standards-setting Joint Electron Device Engineering Council (Jedec) meeting in Seattle in late June began work on DDR III DRAM standard. The same group previously developed the first two industry DDR standards.
Mian Quddus, Samsung Semiconductor Inc.'s director of technology and chairman of the memory module committee of Jedec, said the committee would again seek a "systems solution, meaning that specs for modules, components, registers and buffers will all be developed at the same time."
Jedec (Arlington, Va.) said system manufacturers, DRAM suppliers, connector companies, chip set vendors and test companies would all participate in developing the DDR III spec as the next DRAM standard.
The group provided no timetable for completing the standard.
