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Xilinx rolls out core for high-speed connections








EE Times


SANTARINI_MIKEXilinx Inc. (San Jose, Calif.) has released a HyperTransport single-ended slave intellectual-property core for use with the company's Virtex-II Platform FPGAs. The cores are targeted at designers of networking and storage systems who need an off-the-shelf solution that supports the HyperTransport interface. Potential applications, said Xilinx, include a four-port HyperTransport switch, packet processing and high-end Secure Sockets Layer security content processing through interfacing with third-party network processors.

HyperTransport is a high-speed, high-performance, point-to-point interconnect technology designed to enable PC, communication and networking devices to communicate with one another up to 48 times faster than with existing technologies. Xilinx said it worked with the HyperTransport Technology Consortium to deliver a solution that complies with the HyperTransport electrical and protocol specs.

The solution includes the 800-Mbit/second single-ended slave core, along with reference designs for the configurable address decode, configuration status register logic and reset module. The core is available as a Xilinx LogiCore product under terms of the SignOnce intellectual-property license. It is offered for download at xilinx.com/hypertransport. The site license price for the HyperTransport core is $25,000.

Memory core vendor MoSys Inc. (Sunnyvale, Calif.) has added seven new companies to its 1T-SRAM Design Services Alliance, expanding the program to more than 20 members. The program provides licensees of the 1T-SRAM technology, which is increasingly making its way into system-on-chip designs, with specialized support, MoSys said. The seven new members are Accent in Italy, Ardentec in Taiwan, Comit Systems in the United States, Faraday, with Taiwan and U.S. operations, Global UniChip of Taiwan, RealVision in Japan and Sidsa of Spain. For more information, visit mosys.com/news_set.html.










The views and opinions expressed in this column are strictly those of the author and should not be taken as an editorial position of EE Times or any of its other editors, publications or Web sites.


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