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Content posted in January 2008
Under the Hood: CSR evolves along with Bluetooth
Teardown  
1/28/2008   Post a comment
Cambridge Silicon Radio (CSR) has a reputation in the industry as a strong provider of Bluetooth solutions.
Under the Hood: 45 nm: What Intel didn't tell you
Teardown  
1/21/2008   1 comment
As noted in EE Times almost one month prior to the December 2007 International Electron Devices Meeting (IEDM), the main features of Intel's 45-nanometer process technology are the incorporation of high-k hafnium-based dielectric material, titanium nitride (TiN) for the PFET replacement gate and a TiN barrier alloyed with a work function tuning metal for the NFET replacement gate.
Under the Hood: Low-cost phone is rich in features
Teardown  
1/7/2008   Post a comment
At an estimated total cost to manufacture of less than $45 based on a Portelligent teardown analysis, the Tianyu B811 finds itself positioned just above the ultralow-cost voice-only phones, where bill-of-material costs have now dropped below $30.


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