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Content posted in July 2005
LCD driver highly integrated
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7/25/2005   Post a comment
Liquid-crystal displays are quickly becoming the dominant display technology for a wide variety of applications-from mobile appliances such as handsets, PDAs and MP3 players to large-format systems like wide-aspect-ratio high-definition televisions.
Pay-radio receiver rocks
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7/18/2005   Post a comment
You probably already pay a cable or satellite TV bill, even though free programming is out there for the taking. Now, in growing numbers, consumers are also buying their broadcast audio, despite the clutter of freely available AM and FM channels on their radio dials. The two primary providers of satellite pay-radio systems, Sirius and XM, hope that all of us spendthrifts keep it up, and they're responding to market growth with increasingly portable receiver designs to help listeners tune in-both
Under The Hood: Analog Rocks in Delphi's XM Roady2
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7/13/2005   Post a comment
The two providers of satellite pay radio, Sirius and XM, hope that all of us spend-happy consumers keep it up and are responding to market growth with increasingly portable receiver designs to help listeners tune in anywhere in the mainland U.S., writes David Carey. In this Under the Hood feature from July's Planet Analog magazine folio, David lifts the lid on Delphi's newest entry.
Plasma TV hits sweet spot
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7/11/2005   Post a comment
The past year has witnessed explosive growth in plasma TV, with a 56 percent increase in the number of products being offered at major U.S. retail outlets. During the same period, the number of retail competitors has also jumped, by a whopping 27 percent. And all of them are fighting for a piece of the increasingly fragmented plasma TV pie.
Process vs. density in DRAMs
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7/4/2005   Post a comment
The DRAM marketplace is one of the toughest markets in the semiconductor industry because margins are razor thin, even for the most cost-effective manufacturers. Therefore, DRAM makers must continually find ways to reduce cost while meeting market demands for larger memory densities and higher speeds. The most effective method available is to reduce die size through process shrinks and innovative design techniques such as 6F2 cell design.


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