Leti Tweaks SRAM to Improve SoC Memory
News & Analysis 12/15/2017 Post a comment
Leti researchers presented a high-density SRAM bitcell on its CoolCube 3D platform, which reduces the area required for memory by 30 percent, while maintaining full device functionality
IBM Quantum Woos Fortune 500
News & Analysis 12/14/2017 5 comments
Fortune 500 companies, academic institutions and national research labs are signing up to use IBM's quantum computers — called IBM Q — hosted in the cloud.
Karamba Says It Can Protect CAN
News & Analysis 12/13/2017 3 comments
Thus far, Trillium has been the sole voice promoting 30-year-old CAN bus protection. Now Karamba Security is in the game, claiming it better because SafeCAN authenticates a CAN bus-based network with “zero network overhead.”
Is Big Data for IC Design Too Big to Manage?
News & Analysis 12/13/2017 Post a comment
In the big-data era, semiconductor companies are designing ICs for data centers. The question is if these chip designers use big data themselves. After all, there’s no shortage of raw data – spit out by different EDA vendors’ tools.
ST, Ams Sense 3D Trend
News & Analysis 12/13/2017 4 comments
ST and Ams have identified 3D sensing as the biggest growth segment in sensors. To frame their success as a lucky break induced by iPhone X would be an understatement. Both are boldly taking on the complex technology challenges.
Redpine Flexes ‘Lowest-Power’ Wireless MCU
News & Analysis 12/12/2017 Post a comment
Redpine is rolling out the industry’s lowest-power wireless combo solution featuring advanced security with integrated Bluetooth 5, dual-band Wi-Fi, 802.15.4/ZigBee/Thread, for battery-operated IoT applications
With Alkaline Chemistry, Copper Could Be Forever
News & Analysis 12/12/2017 3 comments
Aveni’s alkaline chemistry for building copper interconnects at and below the 5-nm node could realize IBM’s recent prediction that there will be no need to switch to cobalt or any other interconnect metal less conductive than copper.
TSMC Speeds Opening of China Fab
News & Analysis 12/8/2017 2 comments
TSMC said it aims to open its second fab in China earlier than originally expected in order to meet strong demand in the world’s fastest growing semiconductor market.
Intel’s EyeQ 5 vs. Nvidia’s Xavier: Wrong Debate
News & Analysis 12/6/2017 2 comments
The specsmanship battle by Nvidia and Intel over AI chips reached a new high, when Intel CEO claimed EyeQ 5 “can deliver more than twice the deep-learning performance efficiency” than Xavier SoC. Nvidia called us and cried foul.
4DS Enlists IMEC to Advance ReRAM
News & Analysis 12/1/2017 1 comment
Collaboration aims to demonstrate 4DS' production back-end-of-line process on IMEC's CMOS megabit memory vehicle processed at 300mm wafers to make 1Mb devices
Apple's Plans Could Doom Dialog Semi
News & Analysis 12/1/2017 2 comments
Speculation that Apple will begin designing its own power management chips by next year could be bad news indeed for its primary supplier of these parts, Dialog Semiconductor.
Velodyne Pads Lead in Lidar Derby
News & Analysis 11/29/2017 1 comment
Velodyne LiDAR is still lapping the field in an embryonic but increasingly competitive lidar market, an advantage that grew when it unveiled a new 128-channel lidar sensor. The VLS-128 boasts range and resolution that other lidars have not offered.
U.S. Angles to Retake Supercomputer Lead
News & Analysis 11/29/2017 5 comments
IBM, Intel, and AMD supercomputing platforms aim to beat China to exabyte computing, obsoleting the Top500’s distributed-memory version of the Linpack benchmarks in the process.
RISC-V Spins into Drives, AI
News & Analysis 11/28/2017 5 comments
Western Digital and startup Esperanto tipped plans for storage and machine-learning chips using the open-source RISC-V architecture.
CEA-Leti Moves Fast on New CEO
News & Analysis 11/28/2017 3 comments
CEA-Leti, one of the largest micro- and nanotechnologies research institutes in Europe, lost its head recently, but recovered by naming Emmanuel Sabonnadiere as CEO, succeeding Marie-Noëlle Semeria. CEA-Leti has provided no explanation of Semeria’s contract non-renewal.
MEMS Design Shrinks Speakers to Chip Scale
News & Analysis 11/22/2017 3 comments
USound has developed microelectromechanical system (MEMS) chip-scale audio speakers, targeting in- and over-ear high-fidelity earbuds, smartphones, multidriver headphones, and other IoT wearables.
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