Redpine Flexes ‘Lowest-Power’ Wireless MCU
News & Analysis 12/12/2017 Post a comment
Redpine is rolling out the industry’s lowest-power wireless combo solution featuring advanced security with integrated Bluetooth 5, dual-band Wi-Fi, 802.15.4/ZigBee/Thread, for battery-operated IoT applications
With Alkaline Chemistry, Copper Could Be Forever
News & Analysis 12/12/2017 1 comment
Aveni’s alkaline chemistry for building copper interconnects at and below the 5-nm node could realize IBM’s recent prediction that there will be no need to switch to cobalt or any other interconnect metal less conductive than copper.
TSMC Speeds Opening of China Fab
News & Analysis 12/8/2017 1 comment
TSMC said it aims to open its second fab in China earlier than originally expected in order to meet strong demand in the world’s fastest growing semiconductor market.
Intel’s EyeQ 5 vs. Nvidia’s Xavier: Wrong Debate
News & Analysis 12/6/2017 2 comments
The specsmanship battle by Nvidia and Intel over AI chips reached a new high, when Intel CEO claimed EyeQ 5 “can deliver more than twice the deep-learning performance efficiency” than Xavier SoC. Nvidia called us and cried foul.
4DS Enlists IMEC to Advance ReRAM
News & Analysis 12/1/2017 1 comment
Collaboration aims to demonstrate 4DS' production back-end-of-line process on IMEC's CMOS megabit memory vehicle processed at 300mm wafers to make 1Mb devices
Apple's Plans Could Doom Dialog Semi
News & Analysis 12/1/2017 2 comments
Speculation that Apple will begin designing its own power management chips by next year could be bad news indeed for its primary supplier of these parts, Dialog Semiconductor.
Velodyne Pads Lead in Lidar Derby
News & Analysis 11/29/2017 1 comment
Velodyne LiDAR is still lapping the field in an embryonic but increasingly competitive lidar market, an advantage that grew when it unveiled a new 128-channel lidar sensor. The VLS-128 boasts range and resolution that other lidars have not offered.
U.S. Angles to Retake Supercomputer Lead
News & Analysis 11/29/2017 5 comments
IBM, Intel, and AMD supercomputing platforms aim to beat China to exabyte computing, obsoleting the Top500’s distributed-memory version of the Linpack benchmarks in the process.
RISC-V Spins into Drives, AI
News & Analysis 11/28/2017 5 comments
Western Digital and startup Esperanto tipped plans for storage and machine-learning chips using the open-source RISC-V architecture.
CEA-Leti Moves Fast on New CEO
News & Analysis 11/28/2017 3 comments
CEA-Leti, one of the largest micro- and nanotechnologies research institutes in Europe, lost its head recently, but recovered by naming Emmanuel Sabonnadiere as CEO, succeeding Marie-Noëlle Semeria. CEA-Leti has provided no explanation of Semeria’s contract non-renewal.
MEMS Design Shrinks Speakers to Chip Scale
News & Analysis 11/22/2017 3 comments
USound has developed microelectromechanical system (MEMS) chip-scale audio speakers, targeting in- and over-ear high-fidelity earbuds, smartphones, multidriver headphones, and other IoT wearables.
Samsung Likely to Unseat Intel as Top Chip Vendor
News & Analysis 11/22/2017 6 comments
Samsung, which has nearly half of the global DRAM market, is likely to crush smaller rivals after more than doubling its plan for capital expenditures in its semiconductor unit for this year, according to market analyst IC Insights.
Analysts Applaud Marvell-Cavium Deal
News & Analysis 11/21/2017 6 comments
Analysts generally praised the merger of Marvell and Cavium as diversifying into broader comms and networking markets but were wary of revenue and profit growth.
Women in Tech: 25 Profiles in Persistence
News & Analysis 11/20/2017 7 comments
EE Times profiled 25 women in tech. Our goal is to trigger discussions in the workplace, and around the dinner table about women in engineering — not as numbers, but as real people, as colleagues and bosses, mentors and protégés.
iPhone X’s TrueDepth Module Dissected
News & Analysis 11/17/2017 3 comments
Although imaging experts are aware of a complex “TrueDepth” module that Apple has devised for its iPhone X, most other details inside the device’s 3D system — chips, components, and all the way down to substrates — remain a deep, dark secret.
Taiwan R&D Group Rolls AI for Fault Prediction
News & Analysis 11/17/2017 Post a comment
Taiwan’s Industrial Technology Research Institute (ITRI), one of the world's largest high-tech research institutions, has introduced AI software that can predict breakdowns in production-line equipment, helping to eliminate factory downtime and boost human productivity.
AI to Spur Uptick in ASIC Design Starts
News & Analysis 11/17/2017 Post a comment
With the surge in popularity of voice activated digital assistants like Amazon Echo and the general frenzy of activity around artificial intelligence, a growing number of ASICs will incorporate these some form of AI over the next few years, according to Semico Research.
Beating IoT Big Data With Brain Emulation
News & Analysis 11/17/2017 8 comments
Bosch Sensortec demonstrated its sophisticated three-tiered methodology for solving the real-time Big Data deluge with smart sensors that send summaries every few seconds to hubs, which in turn send trends to the cloud every few minutes, where they are analyzed and fed back to the user as actionable information.
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