Latest Content tagged with SoC Designline
Four Big Trends to Watch at CES 2018
News & Analysis 12/18/2017 Post a comment
The factors that distinguish CES 2018 from last year are the pervasiveness of AI, connectivity and software platforms. A broader theme is how all these technologies, once they get connected, will alter consumers’ perception of reality.
Leti Tweaks SRAM to Improve SoC Memory
News & Analysis 12/15/2017 Post a comment
Leti researchers presented a high-density SRAM bitcell on its CoolCube 3D platform, which reduces the area required for memory by 30 percent, while maintaining full device functionality
Is Big Data for IC Design Too Big to Manage?
News & Analysis 12/13/2017 Post a comment
In the big-data era, semiconductor companies are designing ICs for data centers. The question is if these chip designers use big data themselves. After all, there’s no shortage of raw data – spit out by different EDA vendors’ tools.
ST, Ams Sense 3D Trend
News & Analysis 12/13/2017 4 comments
ST and Ams have identified 3D sensing as the biggest growth segment in sensors. To frame their success as a lucky break induced by iPhone X would be an understatement. Both are boldly taking on the complex technology challenges.
Redpine Flexes ‘Lowest-Power’ Wireless MCU
News & Analysis 12/12/2017 Post a comment
Redpine is rolling out the industry’s lowest-power wireless combo solution featuring advanced security with integrated Bluetooth 5, dual-band Wi-Fi, 802.15.4/ZigBee/Thread, for battery-operated IoT applications
With Alkaline Chemistry, Copper Could Be Forever
News & Analysis 12/12/2017 3 comments
Aveni’s alkaline chemistry for building copper interconnects at and below the 5-nm node could realize IBM’s recent prediction that there will be no need to switch to cobalt or any other interconnect metal less conductive than copper.
TSMC Speeds Opening of China Fab
News & Analysis 12/8/2017 2 comments
TSMC said it aims to open its second fab in China earlier than originally expected in order to meet strong demand in the world’s fastest growing semiconductor market.
Intel’s EyeQ 5 vs. Nvidia’s Xavier: Wrong Debate
News & Analysis 12/6/2017 2 comments
The specsmanship battle by Nvidia and Intel over AI chips reached a new high, when Intel CEO claimed EyeQ 5 “can deliver more than twice the deep-learning performance efficiency” than Xavier SoC. Nvidia called us and cried foul.
RISC-V Spins into Drives, AI
News & Analysis 11/28/2017 5 comments
Western Digital and startup Esperanto tipped plans for storage and machine-learning chips using the open-source RISC-V architecture.
CEA-Leti Moves Fast on New CEO
News & Analysis 11/28/2017 3 comments
CEA-Leti, one of the largest micro- and nanotechnologies research institutes in Europe, lost its head recently, but recovered by naming Emmanuel Sabonnadiere as CEO, succeeding Marie-Noëlle Semeria. CEA-Leti has provided no explanation of Semeria’s contract non-renewal.
Samsung Likely to Unseat Intel as Top Chip Vendor
News & Analysis 11/22/2017 6 comments
Samsung, which has nearly half of the global DRAM market, is likely to crush smaller rivals after more than doubling its plan for capital expenditures in its semiconductor unit for this year, according to market analyst IC Insights.
Analysts Applaud Marvell-Cavium Deal
News & Analysis 11/21/2017 6 comments
Analysts generally praised the merger of Marvell and Cavium as diversifying into broader comms and networking markets but were wary of revenue and profit growth.
Women in Tech: 25 Profiles in Persistence
News & Analysis 11/20/2017 6 comments
EE Times profiled 25 women in tech. Our goal is to trigger discussions in the workplace, and around the dinner table about women in engineering — not as numbers, but as real people, as colleagues and bosses, mentors and protégés.
iPhone X’s TrueDepth Module Dissected
News & Analysis 11/17/2017 3 comments
Although imaging experts are aware of a complex “TrueDepth” module that Apple has devised for its iPhone X, most other details inside the device’s 3D system — chips, components, and all the way down to substrates — remain a deep, dark secret.
PA Semi, Apple ‘Interconnect’ at Startup
News & Analysis 11/15/2017 1 comment
With a body of engineering experience at LSI, Cisco, SiByte, Broadcom, PA Semi and Apple, Shailendra Desai is confident of his knowledge in SoC designs and what needs to be done. He unveils Provino, an interconnect IP startup.
Low-cost Lifetime Boost for Lithium Batteries
News & Analysis 11/9/2017 2 comments
Taiwan’s Industrial Technology Research Institute is seeking a U.S. patent on a composite paste that OEMs can apply to battery electrodes to prevent solid electrolyte interface buildup and thereby extend battery life up to 70%.
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