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Analysts Applaud Marvell-Cavium Deal
News & Analysis  
11/21/2017   2 comments
Analysts generally praised the merger of Marvell and Cavium as diversifying into broader comms and networking markets but were wary of revenue and profit growth.
Samsung Shows EUV Design at ISSCC
News & Analysis  
11/13/2017   6 comments
Samsung will describe a 7nm SRAM cell made using EUV lithography at ISSCC amid advances in processors, sensors and specialty memories.
Samsung Finds its Online Voice
Slideshow  
10/19/2017   Post a comment
Samsung made Bixby the heart of its developer event, but it faces stiff challenges competing with machine-learning and voice services from Web rivals.
Samsung Secures IoT Node-to-Cloud
News & Analysis  
10/18/2017   3 comments
Samsung announced security spanning end nodes, gateways, and cloud services for its ambitious Artik platform for the Internet of Things.
Intel, G’foundries Bring 10, 7nm to IEDM
News & Analysis  
10/18/2017   3 comments
Intel and Globalfoundries will describe their 10 and 7nm process nodes at IEDM, respectively.
WD Gives Hard Drives New Spin
News & Analysis  
10/12/2017   1 comment
Western Digital said it will start shipping in 2019 a new recording head technology that will enable 40 TByte hard disk drives by 2025.
Apple Watch Packs Q’comm LTE
News & Analysis  
10/5/2017   3 comments
The Apple Watch 3 uses a Qualcomm LTE modem, PMIC and RF transceiver, according to a teardown from TechInsights.
IEEE S3S 2017 Showcases Monolithic 3D Technologies
Blog  
10/2/2017   16 comments
A technology that could bridge the processor memory gap, Monolithic 3D has DARPA's attention. The agency wants proposals by Nov 6. Learn more at an upcoming IEEE conference.
DDR5 Runs in Rambus’ Labs
News & Analysis  
9/20/2017   4 comments
Rambus has working chips in the lab for DDR5, the next-generation DRAM bus, while the industry debates the road ahead for memory in servers.
Facebook Shows Smartphone AI
News & Analysis  
9/1/2017   4 comments
Facebook demoed neural network inference in smartphones at its @Scale event, where a researcher described work on DNA storage.
Ex-Baidu Scientist Blazes AI Shortcut
News & Analysis  
8/31/2017   4 comments
Ren Wu, formerly a distinguished scientist at Baidu, has pulled a new AI chip company out of his sleeve, called NovuMind. In an exclusive interview with EE Times, Wu discussed the startup’s developments and what he hopes to accomplish.
Samsung to Invest $7 Billion in China Fab
News & Analysis  
8/29/2017   3 comments
Samsung will invest $7 billion over a three-year period to ramp up a Chinese fab to expand production of NAND flash memory that’s in strong demand for smartphones and other mobile devices.
Samsung Verdict Jolts South Korea
News & Analysis  
8/25/2017   5 comments
A five-year sentence for Samsung Group’s boss will shake up Korea’s conglomerates but is not expected to impact surging electronics businesses.
Microsoft Describes Next Xbox SoC
News & Analysis  
8/22/2017   Post a comment
Microsoft described at Hot Chips its Scorpio SoC in the upcoming Xbox One X and it decision not to use high-bandwidth memory.
Can ST Unseat NXP in iPhone NFC?
News & Analysis  
8/17/2017   10 comments
When Apple next month rolls out its new iPhones, whose NFC chip will be inside? Right now, ST is keeping mum. Most analysts remain skeptical of the possibility, although some said it’s “conceivable.”
NAND Clash Spans Chip to Code
News & Analysis  
8/14/2017   4 comments
The Flash Memory Summit saw NAND chips move toward four bits/cell as new options for solid-state drives and software emerged for data centers.
Gen-Z Points to New Memories
News & Analysis  
8/10/2017   2 comments
The Gen-Z Consortium has first prototypes for its interconnect, pointing toward a disruptive future of many persistent memories.
Samsung Promises 2018 Tbit NAND
News & Analysis  
8/8/2017   1 comment
Samsung is sampling Z-NAND drives with 15-microsecond latency and announced plans for 3D-NAND chips that would enable Tbit devices.
Gbit MRAM Debuts at Flash Summit
News & Analysis  
8/7/2017   7 comments
Everspin will debut a Gbit MRAM chip and 1-2 Gbyte cards, expanding the non-volatile alternatives to NAND at the annual Flash Memory Summit.
IBM Claims Tape Density Record
News & Analysis  
8/3/2017   2 comments
In a boost for Big Data, IBM Research has set a tape areal-density record of 201 gigabytes/square inch on nano-grained sputtered tape from Sony Storage Media Solutions.
Fab: Millstone Around Your Neck. Or Pearls?
Blog  
8/1/2017   4 comments
Our blind faith in fabless strategies must be challenged. Why does ST value its Rousset Fab, and why on earth is Apple sending a design team to Grenoble?
PC Sales Raise Intel’s Q2
News & Analysis  
7/27/2017   12 comments
Intel reported revenue and profit growth and raised its annual forecast, in part on the strong of PC sales.
Qualcomm, Apple, Samsung and You
Blog  
7/7/2017   8 comments
As Samsung leapfrogs Intel and Qualcomm strikes new blows in its boxing match with Apple, engineers need to cover their bets and enjoy the show.
U.S. Seeks Life After Moore’s Law
News & Analysis  
7/5/2017   12 comments
DARPA will host events this month to outline a $200+ million program to find ways of scaling electronics beyond Moore’s law.
Fatal Tesla Crash: That’s Not All, Folks
Blog  
6/27/2017   4 comments
The NTSB's report contains a few surprises, including how and where Tesla’s captured data is stored, routed and saved inside a vehicle.
AMD Rolls Epyc Server SoCs
News & Analysis  
6/20/2017   3 comments
AMD formally announced Epyc, a family of server SoCs using its Zen x86 core, weeks before Intel is expected to debut its 10-nm Skylake Xeon chips.
Exascale Project Awards $258M
News & Analysis  
6/15/2017   1 comment
Six U.S. chip and systems companies will split $258 million in grants to do research toward building an exascale-class supercomputer by 2021.
G’foundries Updates 7nm, EUV Plan
News & Analysis  
6/13/2017   4 comments
Globalfoundries provided more detail on its 7nm and EUV plans claiming its process is ready for designs and exceeding targets.
Apple Turns Up Speakers, AR
News & Analysis  
6/5/2017   4 comments
Apple rolled out a Siri-powered music speaker, developer’s kits for AR and machine learning and new iMac and iPad Pro systems.
3DXP's Memory Role Unclear
News & Analysis  
5/31/2017   7 comments
Customers and analysts have mixed views on the outlook for Intel’s 3D XPoint chips as main memories in servers 2018.
What’s Driving Automotive Storage?
Blog  
5/30/2017   Post a comment
In addition to rapidly changing infotainment systems, more connected cars, ADAS and autonomous cars are drastically altering automakers' requirements for local on-board storage in the vehicle.
Sony Launches First Three-Layer, 960 fps Camera with Sandwich-Stacked DRAM
Blog  
5/25/2017   2 comments
Details given in an ISSCC conference paper looked like the real thing; this caught the attention of our image-sensor experts inside TechInsights.
Imec Tips Novel AI Chips
News & Analysis  
5/16/2017   4 comments
The Imec research institute described work on two low cost self-learning chips that use MRAM and ReRAM arrays rather than neural networks.
Future Cars Face Terabyte Memory Load
News & Analysis  
5/10/2017   2 comments
For a highly automated car in, say, 2020, how much memory capacity, to capture, process and store data, will be enough? An industry consensus is this connected vehicle will require data storage of close to a terabyte.
Marvell's New CTO Wants 'Culture of Innovation'
News & Analysis  
5/8/2017   10 comments
Neil Kim, the new CTO at troubled Marvell, spent an hour with EE Times at the end of his first week on the job, sharing his goals and views.
Micron Leap Frogs NVMe Over Fabric Standards
News & Analysis  
5/3/2017   Post a comment
SolidScale architecture is Micron's answer to how NVMe can become more mainstream as it moves further along the path to becoming a storage company
Politics Muddy Toshiba Bidding
News & Analysis  
4/29/2017   8 comments
As the second round of bidding for Toshiba’s coveted memory business draws near, the opaque process is exposing a deep schism of interests in Japan among politicians, bureaucrats and bankers. But did anyone ask what engineers want?
Intel Boosts CapEx 20%
News & Analysis  
4/27/2017   5 comments
Intel will boost capital spending 20 percent this year and next to ramp 3D NAND and 3DXP memories, it said reporting quarterly financial gains.
Micron Makes Mehrotra Next CEO
News & Analysis  
4/27/2017   2 comments
Micron named flash co-inventor and former SanDisk CEO Sanjay Mehrotra as its next chief executive, effective May 8.
3D Chip Stacks Eye Data Centers
News & Analysis  
4/12/2017   8 comments
High-end microprocessors will embrace wafer- and die-level chip stacks over the next few years, said a former Oracle researcher turned consultant.
IoT Needs Embedded Cryptography
Blog  
4/6/2017   3 comments
Security is a top concern for the Internet of Things, as essential as low power consumption, affordability, and wireless connectivity.
Intel Pumps Up PCs with Optane
News & Analysis  
3/27/2017   13 comments
Intel announced two M.2 cards using its 3D XPoint memories, aimed at accelerating hard-disk performance in PCs.
Intel Boots Drives with 3D XPoint
News & Analysis  
3/19/2017   22 comments
Intel announced its first solid-state drives using its 3D XPoint memory chips, getting a long-awaited foothold in a market between flash and DRAM.
ARM Servers ‘Compelling’ for Microsoft
Slideshow  
3/9/2017   5 comments
Microsoft said it is testing Cavium and Qualcomm ARM SoCs for its data center at the Open Compute event where Facebook and IBM unveiled new servers.
What's This Screeching Sound & Why Does it Occur?
Engineering Investigations  
2/21/2017   25 comments
Upgrading a PC's memory resulted in screeching sounds whenever it tried to play audio. Has this ever happened to you?
TSMC, Samsung Diverge at 7nm
News & Analysis  
2/8/2017   10 comments
TSMC and Samsung described 7nm SRAMs at ISSCC, showing how different the companies’ process offerings will be under than name.
Toshiba Confirms Memory Chip Spinoff
News & Analysis  
1/27/2017   3 comments
Toshiba formally announced that it will sell a chunk -- but less than 20 percent -- of its memory chip business. Toshiba will proceed with its expansion plan for 3D flash memory production as scheduled.
Trump, Brexit Cloud Upbeat 2017
News & Analysis  
1/27/2017   7 comments
The semiconductor market is posed for a better year ahead but uncertainties with President Trump, China and Brexit could sway the numbers.
Talent Hunt in China's Memory Triangle
News & Analysis  
1/26/2017   19 comments
Tsinghua Unigroup’s recently disclosed d plans to build a $30 billion memory chip in Nanjing was unexpected – even by many China watchers. Unfolding are fierce battles over talent, manufacturing equipment and regional financing – among Xi’an, Wuhan and Nanjing.
Samsung Expects Strong Memory Sales in '17
News & Analysis  
1/26/2017   2 comments
Samsung Electronics, the world’s largest maker of smartphones and the second-largest chipmaker, said it expects strong memory sales this year as the balance between supply and demand tightens.
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Aloha from EEWeb
Max Maxfield
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Just a few minutes ago as I pen these words, I posted this blog about this month's Cartoon Punchline Competition over on EEWeb.com.